Substrate Fluid Supply Control for Accurate Supercritical Drying
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Solution Overview
Problem
Existing substrate processing systems face challenges in accurately controlling the flow rate of processing fluids, particularly when transitioning between liquid and supercritical states, leading to inefficiencies and potential pattern collapse during drying processes.
Innovation Solution
A substrate processing apparatus with a fluid supply device that includes a pressurizer, supply flow measurer, and supply flow regulator, controlled by a controller, to precisely manage the flow rate and pressure of processing fluids, ensuring accurate delivery and preventing pattern collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a back pressure regulating valve is used to control flow rate in a circulation line, then flow rate control is achieved, but measurement accuracy deteriorates because the flow rate cannot be measured upstream of the pressurizer
Solution Approach 1:
A communication mechanism (intermediary) is introduced between the upstream and downstream sides of the pressurizer. The downstream flow rate measurement is transmitted to the upstream side through this intermediary, enabling accurate flow rate control at the supply source without direct measurement upstream of the pressurizer.
Solution Approach 2:
The system implements feedback control by measuring the flow rate downstream of the pressurizer and using this information to regulate the flow rate upstream. The controller adjusts the supply flow rate based on the measured downstream flow rate, creating a closed-loop control system that ensures accurate flow rate delivery despite the pressurizer's presence.
2Manufacturing precision
If flow rate control is not accurate during supercritical drying, then processing efficiency improves, but manufacturing precision deteriorates due to pattern collapse
Solution Approach 1:
The system uses feedback control to continuously monitor and adjust the flow rate of the processing fluid. By measuring the actual flow rate downstream of the pressurizer and comparing it with the target flow rate, the controller makes real-time adjustments to maintain precise flow rate control throughout the drying process, preventing pattern collapse while maintaining efficiency.
Solution Approach 2:
The patent replaces manual or simple mechanical flow rate control with an automated control system that uses sensors and controllers. This substitution enables precise, dynamic adjustment of flow rate based on actual process conditions, ensuring substrate pattern integrity while maintaining drying efficiency.
3Reliability
If the supply flow rate is not accurately controlled, then device complexity is reduced, but reliability deteriorates due to seal biting and particle generation
Solution Approach 1:
The system implements feedback control by measuring the flow rate downstream of the pressurizer and using this information to regulate the flow rate upstream. This closed-loop control ensures reliable operation by preventing seal biting and particle generation through accurate flow rate management.
Solution Approach 2:
A communication intermediary transmits flow rate measurement data from the downstream side to the upstream side, enabling coordinated control across the pressurizer boundary. This intermediary ensures that flow rate control actions are synchronized, improving system reliability without requiring complex direct coupling between upstream and downstream components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the accuracy of flow rate control, reduces particle generation, and prevents seal biting, thereby improving the efficiency and reliability of substrate processing.
Implementation Method 1
a pressurizer provided in the supply line and configured to increase a pressure of the processing fluid flowing through the supply line
Data Source
AI summary
A substrate processing apparatus according to an aspect of the present disclosure includes a processing device that has a processing space capable of accommodating a substrate whose surface is wet with a liquid, a fluid supply device configured to supply a processing fluid to the processing space, and a controller. The fluid supply device includes a supply line connected to the processing device, a pressurizer provided in the supply line and configured to increase a pressure of the processing fluid flowing through the supply line, a supply flow measurer provided on a secondary side of the pressurizer in the supply line, and a supply flow regulator provided on a secondary side of the supply flow measurer in the supply line. The controller controls the supply flow regulator based on a supply flow rate of the processing fluid measured by the supply flow measurer.