Substrate Flux Coating Segmentation for Conduction Reliability
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Solution Overview
Problem
In integrated electric compressors for vehicle-mounted air conditioners, flux used for soldering can flow out of designated areas, causing conduction failures by preventing electrical connection between the circuit substrate and the housing.
Innovation Solution
A substrate configuration with a flux coating portion, a conductive conduction portion separated from the flux coating, and a silk portion disposed between the flux coating and conduction portions to inhibit flux movement, with the conduction portion surrounding fixing holes to ensure stable electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If flux is coated to improve solder fluidity, then soldering quality is improved, but flux may flow out to conduction portions causing conduction failures
Solution Approach 1:
The substrate surface is segmented into distinct functional zones: flux coating portions for soldering, resist portions for isolation, and conduction portions for electrical connection. This spatial segmentation prevents flux from flowing onto conduction portions while maintaining soldering quality in designated areas.
Solution Approach 2:
Different surface regions are given different properties: flux coating portions have properties that promote solder fluidity, resist portions have properties that repel or block flux, and conduction portions maintain electrical conductivity. This local differentiation allows flux to be applied where needed without contaminating conduction paths.
2Area of stationary object
If conduction portion is disposed close to flux coating portion for compact design, then space utilization is improved, but flux flow-out risk increases
Solution Approach 1:
A resist portion is introduced as an intermediary element between the flux coating portion and the conduction portion. This resist portion acts as a barrier that prevents flux from flowing from the flux coating area to the conduction area, enabling compact layout without increasing flux contamination risk.
Solution Approach 2:
The problem is solved by adding a dimensional barrier (the resist portion extending in the vertical direction or creating a physical barrier) rather than relying solely on horizontal distance. This allows close proximity in the plan view while maintaining protection through a third-dimensional barrier.
Data Source
AI summary
A substrate includes a substrate body, a flux coating portion which is coated with flux promoting solder fluidity on a surface of the substrate body, a conduction portion which is disposed on the surface of the substrate body to be separated from the flux coating portion and is conductive, and a silk portion which is disposed between the flux coating portion and the conduction portion on the surface of the substrate body and is provided by silk printing.

