Substrate Frame Structure Removal to Prevent Burrs and Warpage
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Solution Overview
Problem
During semiconductor package manufacturing, the frame structure on a substrate after sawing often results in burrs and warpage, which hinder subsequent operations.
Innovation Solution
A method involving a substrate with an active region and a side rail, where a frame structure is formed on the side rail and then removed with a predetermined distance from its inner edge to prevent burrs and warpage, ensuring smooth manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a frame structure is left on the substrate after sawing, then the substrate structure is complete, but burrs and warpage occur on the substrate
Solution Approach 1:
The frame structure is removed in advance before subsequent semiconductor package manufacturing operations. This preliminary removal action prevents the frame structure from causing warpage and burrs during later processing steps, ensuring substrate flatness is maintained throughout the manufacturing sequence.
Solution Approach 2:
The frame structure is extracted or removed from the substrate after the sawing process. By taking out the frame structure that would otherwise remain on the substrate, the harmful effects of warpage and burr formation are eliminated, allowing subsequent operations to proceed on a flat, clean substrate surface.
2Manufacturing precision
If the frame structure is removed completely, then burrs and warpage are prevented, but additional processing steps are required
Solution Approach 1:
The frame structure removal is performed as a preliminary step integrated into the existing manufacturing flow. By planning and executing the removal early in the process sequence, the need for complex corrective operations later is avoided, and substrate flatness is established before subsequent bonding and packaging operations.
Data Source
AI summary
An assembly structure and a method for manufacturing the same are provided. The method for manufacturing the assembly structure includes providing a substrate defining an active region and a side rail surrounding the active region; and forming a frame structure on the side rail.