Substrate Frame Transfer Mechanism for Precise Wafer Thinning
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Solution Overview
Problem
Current semiconductor substrate processing systems face challenges in efficiently transferring and processing substrates during thinning operations, particularly in handling and supporting substrates to prevent damage and deformation, while also ensuring effective processing and handling of substrates with protective tapes and adhesive films.
Innovation Solution
A transfer device and substrate processing system that includes a grip member to hold substrates mounted on a frame with adhesive tape, a guide member for movement along a transfer path, and a moving mechanism to facilitate the transfer of substrates through various processing units, such as dicing, thinning, and mounting, using protective tapes and adhesive films to protect the substrates and improve handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single-purpose transfer device is used for substrate handling, then the device structure is simple, but the processing efficiency is low due to sequential operations
Solution Approach 1:
The transfer device is designed with multiple functional units including a grip member for holding substrates, a guide member for positioning, and a moving mechanism for transfer, allowing a single device to perform multiple operations (transfer, positioning, and support) that previously required separate devices, thereby improving processing efficiency while managing device complexity
2Reliability
If substrates are handled without protective tapes, then the handling process is simpler, but substrate damage occurs more frequently
Solution Approach 1:
Protective tapes are applied to substrates before they enter the processing system, and the transfer device is designed to accommodate and transfer these taped substrates on frames. This preliminary protective action prevents substrate damage during handling and processing operations
3Manufacturing precision
If substrates are transferred manually or with simple mechanisms, then the equipment cost is lower, but the transfer precision and control are insufficient
Solution Approach 1:
The moving mechanism includes a drive unit that controls the transfer of substrates along the transfer path with precision. The guide member works in conjunction with the grip member to ensure accurate positioning, providing the controlled transfer precision needed for thinning operations
Data Source
AI summary
A transfer device, configured to hold a substrate to be thinned and configured to be moved along a transfer path through which the substrate is transferred, includes a grip member configured to hold a frame to which the substrate is mounted with a tape therebetween; a guide member configured to be moved along the transfer path together with the grip member and configured to place thereon the frame held by the grip member; and a moving mechanism configured to move the grip member with respect to the guide member to move the frame held by the grip member along the guide member.