Thin-Film Coil Structure Without Substrate for Higher Inductance
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Solution Overview
Problem
In thin film-type inductors, the presence of a non-magnetic substrate reduces the effective volume and can lead to mechanical processing defects, limiting the inductance properties and increasing the size of electronic devices.
Innovation Solution
A coil component design that removes the substrate entirely, featuring a body with a coil portion covered by insulating films and external electrodes, where the insulating films extend to connect the coils and vias, enhancing the effective volume and reducing manufacturing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If a non-magnetic substrate is used to support the coil portion in a thin film inductor, then the coil structure can be maintained and manufactured, but the effective volume is reduced by the volume occupied by the substrate
Solution Approach 1:
The patent removes the non-magnetic substrate from the inductor structure entirely. The coil portion is formed directly on the magnetic core material without requiring a separate substrate layer, thereby eliminating the volume loss associated with substrate occupation while maintaining coil structural integrity through direct formation on the magnetic material surface.
2Reliability
If a substrate is used to support the coil portion, then the coil structure can be maintained, but mechanical processing defects may occur during substrate processing
Solution Approach 1:
By removing the substrate entirely and forming the coil directly on the magnetic core, the patent eliminates the mechanical processing steps required for substrate preparation, mounting, and alignment. This direct formation approach prevents defects such as substrate cracking, delamination, and positioning errors that would otherwise occur during substrate processing.
3Ease of manufacture
If the substrate volume is occupied, then the inductor can be manufactured with supported coil structure, but the device size cannot be reduced further
Solution Approach 1:
The elimination of the substrate allows the inductor to achieve its minimum possible footprint. The coil is formed directly on the magnetic core surface, enabling tighter integration and smaller overall device dimensions while maintaining adequate coil support through the rigid magnetic core material itself.
Data Source
AI summary
A coil component includes a body including a first surface and a second surface opposing each other in a first direction, a coil portion disposed in the body and including first and second coils, and a via connecting the first and second coils to each other, an insulating film covering the coil portion and extending to a region between the first and second coils, and first and second external electrodes disposed on the body and connected to the coil portion. The insulating film is in contact with at least one of opposing surfaces of the first and second coils which face each other and is in contact with a side surface of the via.