Substrate-Free Light-Emitting Device Array for High-Power Applications
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light-emitting devices require a substrate, which increases production costs, prolongs the manufacturing process, and limits their suitability for high-powered applications due to heat resistance issues and restricted design flexibility.
Innovation Solution
A light-emitting device array is designed without a substrate, featuring a structure with conductive semiconductor layers, bonding layers, and electrodes, where the top surface contacts air, allowing for reduced thickness and increased design freedom, and incorporating a molding layer that may include fluorescent substances for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate is used in conventional light-emitting devices, then structural support and stability are provided, but production costs increase, manufacturing time is prolonged, and design flexibility is limited
Solution Approach 1:
The patent removes the substrate from the light-emitting device structure, extracting the problematic component that caused increased production costs and manufacturing time. The device is now supported by a combination of bonding layers and electrode structures instead of a traditional substrate, achieving both structural support and improved productivity
Solution Approach 2:
The device is divided into separate functional layers (n-type semiconductor layer, active layer, p-type semiconductor layer) that can be independently processed and then bonded together. This segmentation allows for optimized manufacturing of each layer separately and assembly without requiring a continuous substrate throughout the entire process
2Reliability
If a substrate is used in conventional light-emitting devices, then structural stability is maintained, but the device thickness increases
Solution Approach 1:
By removing the substrate, the patent eliminates the primary source of device thickness. The light-emitting structure now consists only of the essential functional layers (n-type semiconductor layer, active layer, p-type semiconductor layer) with bonding layers and electrodes, significantly reducing overall device thickness while maintaining structural stability through alternative support mechanisms
3Ease of manufacture
If a substrate is used in conventional light-emitting devices, then manufacturing process is simplified, but design freedom is reduced
Solution Approach 1:
The device structure is segmented into independently processable layers that can be manufactured separately and then bonded together. This segmentation provides design freedom to optimize each layer independently while maintaining manufacturing simplicity through standardized bonding processes
Solution Approach 2:
The patent changes the fundamental parameter of having a continuous substrate throughout the device structure. By allowing different sections to be substrate-free or having different substrate configurations, design freedom is enhanced while manufacturing remains manageable through controlled parameter variations across different device regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs, shortens manufacturing time, enables high-powered applications, and improves integration, while eliminating substrate-related issues such as static electricity introduction.
Implementation Method 1
the first bonding layer may bond the (1-1)th electrode and the (2-1)th electrode to each other by eutectic bonding, and the second bonding layer may bond the (1-2)th electrode and the (2-2)th electrode to each other by eutectic bonding
Implementation Method 2
Alternatively, the first bonding layer may bond the (1-1)th electrode and the (2-1)th electrode to each other by weld bonding, and the second bonding layer may bond the (1-2)th electrode and the (2-2)th electrode to each other by weld bonding
Implementation Method 3
The molding layer may include a fluorescent substance
Data Source
AI summary
A light-emitting device array according to an embodiment includes a plurality of light-emitting devices connected to each other, each of the light-emitting devices comprising a light-emitting structure comprising a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a (1-1)th electrode connected to the exposed first conductive semiconductor layer; a (1-2)th electrode connected to the second conductive semiconductor layer; (2-1)th and (2-2)th electrodes connected to the (1-1)th and (1-2)th electrodes, respectively; a first bonding layer disposed between the (1-1)th electrode and the (2-1)th electrode; and a second bonding layer disposed between the (1-2)th electrode and the (2-2)th electrode wherein the (2-1)th electrode of the first light-emitting device and the (2-2)th electrode of the second light-emitting device are integrated, and the (2-2)th electrode of the first light-emitting device and the (2-1)th electrode of the second light-emitting device are integrated.