Substrate-Free Light-Emitting Chip Package With Embedded Redistribution Wiring
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Solution Overview
Problem
Conventional light-emitting package structures are difficult to miniaturize due to the presence of substrates and bonding wires, leading to higher costs and larger package volumes, especially when attempting to form flip-chip packages using chip scale package techniques.
Innovation Solution
A light-emitting chip package is developed that includes a light-emitting chip, a molding compound, and a redistribution wiring structure, where the redistribution wiring is formed within the molding compound, allowing for a substrate-free flip-chip package, reducing overall size and fabrication costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional light-emitting package structure with substrate and bonding wires is used, then electrical connection is achieved, but package size cannot be minimized
Solution Approach 1:
The patent extracts and removes the substrate and bonding wires from the conventional package structure. The semiconductor light-emitting die is directly mounted on the molding compound without requiring a separate substrate, and electrical connections are achieved through direct contact or conductive structures integrated into the molding compound, eliminating the need for bonding wires.
Solution Approach 2:
The patent merges the functions of the substrate and bonding wires into the molding compound. The molding compound serves both as a protective encapsulation and as the mounting base for the semiconductor die, while conductive structures within the molding compound provide electrical connections, combining multiple functions into a single integrated structure.
2Volume of moving object
If chip scale package technique is used to form flip-chip light-emitting package, then package size is reduced, but manufacturing cost increases
Solution Approach 1:
The patent uses a molding compound that can be easily formed and molded into the final package structure, replacing expensive substrate materials and complex bonding wire processes. The molding compound serves as a cost-effective solution that integrates multiple functions while maintaining small package size.
Solution Approach 2:
The patent changes the manufacturing approach by using molding processes rather than traditional substrate mounting and wire bonding. This allows for high-volume production with consistent quality and reduced costs, as the molding compound can be injected and cured in a single process step.
3Length of moving object
If substrate and bonding wires are present in package structure, then electrical connection is established, but overall size increases
Solution Approach 1:
The patent removes the substrate and bonding wires from the package structure, eliminating the length and complexity associated with these components. The semiconductor die is directly mounted on the molding compound, and electrical connections are made through direct contact or conductive structures within the molding compound, significantly reducing the overall package dimensions.
Solution Approach 2:
The molding compound serves as an intermediary that provides both mechanical support and electrical connection pathways. Conductive structures embedded in or formed as part of the molding compound establish reliable electrical connections between the semiconductor die and external contacts, replacing the function of bonding wires while reducing package size.
Data Source
AI summary
A light emitting chip package includes a light-emitting chip, a molding compound, and a redistribution wiring structure. The light-emitting chip includes an emission zone, a first electrode, and a second electrode. The molding compound covers at least a sidewall of the light-emitting chip and supports the light-emitting chip. The redistribution wring structure disposed in the molding compound includes a first interconnect wiring structure electrically connected to the first electrode and a second interconnect wiring structure electrically connected to the second electrode. The first interconnect wiring structure and the second interconnect wiring structure respectively include a first pad and a second pad, and the first pad and the second pad are located at the same side of the light emitting chip package.