Substrate-Free LED Packaging via Tape Carrier
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Solution Overview
Problem
The high cost and complexity of packaging light emitting diode (LED) devices due to the need for substrates and traditional packaging processes hinder their commercial viability and scalability.
Innovation Solution
A substrate-free LED package is developed using techniques that eliminate the need for substrates and reduce process steps, allowing for high-volume production with improved cost efficiency and design flexibility by arranging LED dies on tapes, molding encapsulation structures, and singulating them into individual units with dielectric layers and oversized contact regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional LED packaging with substrates is used, then structural support and electrical connection are ensured, but manufacturing cost and process complexity increase significantly
Solution Approach 1:
The patent removes the substrate from the LED packaging structure, extracting the essential light-emitting function from the complex substrate-based assembly. LED dies are mounted directly onto a support structure without requiring a separate substrate layer, thereby simplifying the packaging process and reducing manufacturing costs while maintaining structural integrity and electrical connectivity
Solution Approach 2:
The patent segments the traditional monolithic LED package into modular components: individual LED dies mounted on a support structure, with separate encapsulation layers for light extraction and protection. This segmentation allows for simplified assembly processes, reduced material usage, and easier manufacturing while maintaining the functional integrity of the LED device
2Productivity
If substrate-based LED packaging is used, then mechanical support is provided, but production volume scalability and cost efficiency decrease
Solution Approach 1:
The patent employs preliminary mounting of multiple LED dies onto the support structure in an array configuration before final encapsulation. This preliminary arrangement allows for high-volume production through parallel processing, where multiple dies are prepared and positioned simultaneously, significantly increasing productivity while reducing per-unit manufacturing costs through economies of scale
3Adaptability or versatility
If traditional die attach and wire bonding processes are used, then electrical connection is achieved, but design flexibility and manufacturing complexity increase
Solution Approach 1:
The patent merges the die mounting process with the encapsulation process, where LED dies are directly embedded into the encapsulant material rather than being separately attached to a substrate and then wire-bonded. This consolidation of steps eliminates complex wire bonding operations, reduces the number of process steps, and increases design flexibility while maintaining reliable electrical connections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of LED devices at lower costs with maintained performance and color uniformity, making them more affordable and adaptable for consumer markets.
Implementation Method 1
The LED package typically includes phosphors that convert light generated by the LED into white light, a lens that directs light
Implementation Method 2
The LED package typically includes phosphors that convert light generated by the LED into white light
Data Source
AI summary
A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.