Substrate-Free Multi-Tier Conductive Circuits for Miniaturization
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Solution Overview
Problem
Traditional conductive circuits require rigid substrates, which occupy space and are costly, and current additive manufacturing methods struggle with miniaturization and mass production due to limitations in substrate support and precision.
Innovation Solution
The development of multi-tier conductive circuits without a supporting substrate, using a detachable production platform and innovative solder- and device-dispensers, allowing for precise placement and reinsertion during additive manufacturing, enabling flexible and miniaturized circuit design with improved heat dissipation and reduced material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If traditional supporting substrates are used for conductive circuits, then structural stability is improved, but space occupation and rigidity increase
Solution Approach 1:
The patent removes the traditional supporting substrate from the conductive circuit structure, extracting only the essential conductive elements and devices. This extraction eliminates the space-consuming rigid substrate while maintaining circuit functionality through direct additive manufacturing of conductive paths in 3D space.
Solution Approach 2:
The invention transitions from 2D planar circuits on substrates to 3D multi-tier circuits in space. Conductive circuits are manufactured layer-by-layer using additive technology, allowing circuits to be stacked vertically with devices positioned between tiers, thereby reducing footprint area while maintaining structural integrity through spatial arrangement.
2Ease of manufacture
If traditional substrate-based circuits are used, then manufacturing simplicity is improved, but miniaturization capability deteriorates
Solution Approach 1:
The patent changes the manufacturing parameters by adopting additive manufacturing technology with detachable production platforms. This allows precise positioning and reinsertion of platform sections, enabling miniaturized circuit features to be manufactured with high precision while maintaining ease of production through automated layer-by-layer construction.
3Volume of moving object
If multi-tier circuits without substrate are created, then space efficiency and flexibility are improved, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into manageable sections using a detachable production platform. The platform can be divided into multiple detachable parts that are manufactured separately and then assembled, reducing the overall manufacturing complexity while enabling the creation of complex multi-tier circuit structures with high space efficiency.
Solution Approach 2:
The detachable production platform acts as an intermediary tool that simplifies the manufacturing of multi-tier circuits. It provides a structured framework for layer-by-layer construction, device placement, and tier assembly, thereby reducing the perceived complexity of manufacturing substrate-free 3D circuits while achieving superior space efficiency.
4Strength
If rigid substrates are used, then structural support is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The invention employs a tiered structure with interstitial spaces between circuit layers and devices, creating a porous-like architecture that facilitates heat dissipation. The open spatial arrangement allows heat to dissipate through multiple pathways rather than being trapped in a rigid substrate, improving thermal management while maintaining structural support through the distributed tier framework.
Data Source
AI summary
Four parts of a unity is described here, centered around the multi-tier conductive circuits. The detachable production platform is a prerequisite for manufacturing of these circuits as described. The solder-dispenser is necessary if the circuits are made of anything but magnetic metal powder, or if the means for containing solder material are made solid, and the device-dispenser replaces conventional pick-n-place machines to provide devices to a circuit much quicker and much cheaper.The multi-tier conductive circuit that is the central idea and the final product of the presented innovations is highly flexible and highly cost efficient.The trend of miniaturizing all kinds of electronic equipments has been the outset for these innovations and it is our firm belief that all the industry could benefit highly from such a circuit.