Substrate-Free SiP Module Structure for Ultra-Thin Packaging
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Solution Overview
Problem
Existing semiconductor devices in system in package (SiP) modules are limited by the height of the substrate and encapsulant, which hinders miniaturization and weight reduction.
Innovation Solution
The method involves forming an SiP module without a substrate by embedding conductive bumps into a sacrificial substrate, removing it to expose the bumps, and reducing the overall thickness by eliminating the substrate material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a substrate is used in SiP module to provide structural support and electrical interconnect, then structural support and electrical connectivity are maintained, but the overall height and weight of the module increase
Solution Approach 1:
The patent removes the substrate from the SiP module structure, extracting the element that causes height increase while maintaining essential functions through alternative means (encapsulant provides structural support, bumps provide electrical interconnect without requiring a substrate)
Solution Approach 2:
The encapsulant serves as a thin film structure that replaces the traditional substrate, providing both structural support and electrical isolation functions in a much thinner profile, thereby reducing module height while maintaining necessary mechanical strength
2Weight of stationary object
If a substrate is used in SiP module for structural support, then mechanical strength is maintained, but the weight of the module increases
Solution Approach 1:
The substrate is extracted from the module structure, eliminating its weight contribution while the encapsulant assumes the structural support role, achieving weight reduction without sacrificing mechanical strength
3Volume of moving object
If substrate and encapsulant are both present, then structural support and protection are provided, but the combined height determines the module dimensions and hinders miniaturization
Solution Approach 1:
The patent merges the structural support and protection functions into a single encapsulant structure, eliminating the need for a separate substrate. This consolidation reduces the overall module volume and simplifies the structure while maintaining all necessary functions
Data Source
AI summary
A semiconductor device has a sacrificial substrate and an electrical component disposed over the sacrificial substrate. A bump stop layer is formed within the sacrificial substrate. At least a portion of the bump or terminal of the electrical component is embedded into the sacrificial substrate to contact the bump stop layer. An encapsulant is deposited over the electrical component and sacrificial substrate. A channel is formed through the encapsulant and partially into the sacrificial substrate. The sacrificial substrate is removed to leave a bump or terminal of the electrical component extending out from the encapsulant. A thickness of the semiconductor device is determined by a thickness of the encapsulant and bump extending out from the encapsulant. A portion of the encapsulant can be removed to reduce the thickness of the semiconductor device. A conductive paste can be deposited over the bump or terminal extending out from the encapsulant.