Substrate Furnace Temperature Control for Faster Wafer Stabilization

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in accurately controlling the surface temperature of semiconductor wafers due to the responsiveness difference between furnace and wafer surface temperatures, leading to inefficient processing and increased costs when attempting to stabilize the surface temperature, and existing prediction methods have limitations in accuracy.

Innovation Solution

Optimizing the furnace temperature set value based on a model representing the relationship between furnace and wafer surface temperatures to minimize stabilization time, using a mathematical model to determine optimal temperature control settings.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional temperature control methods are used to stabilize wafer surface temperature, then temperature control is achieved, but processing time increases and costs increase due to responsiveness difference between furnace and wafer surface temperatures

Engineering Contradiction:

Improvetemperature control accuracyVSAvoidprocessing time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The system performs preliminary action by predicting the wafer surface temperature before actual processing based on the mathematical model and furnace temperature. This allows the control system to anticipate temperature changes and adjust furnace temperature proactively, reducing the time required for wafer surface temperature stabilization while maintaining control accuracy.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system implements feedback by continuously monitoring furnace temperature and using the mathematical model to predict wafer surface temperature. The predicted temperature is fed back to the control system, which adjusts the furnace temperature set value accordingly. This closed-loop feedback mechanism reduces processing time by preventing temperature deviations rather than correcting them after they occur.

Inventive Principle:

Principle #23Feedback

2Reliability

If conventional temperature control methods are used to stabilize wafer surface temperature, then temperature control is achieved, but processing costs increase

Engineering Contradiction:

Improvetemperature control accuracyVSAvoidprocessing costs

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

By predicting wafer surface temperature in advance using the mathematical model, the system can optimize furnace temperature adjustments to achieve precise control with minimal energy expenditure. This prevents unnecessary heating and cooling cycles, reducing energy loss and processing costs while maintaining temperature control accuracy.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The feedback mechanism using mathematical modeling allows the system to make precise, data-driven temperature adjustments rather than relying on conservative, energy-intensive control methods. This reduces wasted energy while maintaining reliable temperature control, thereby lowering processing costs.

Inventive Principle:

Principle #23Feedback

3Measurement precision

If existing prediction methods are used for wafer surface temperature, then prediction capability is provided, but accuracy is limited

Engineering Contradiction:

Improvetemperature prediction accuracyVSAvoidmodel complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The system introduces a mathematical model as an intermediary between furnace temperature measurement and wafer surface temperature prediction. This model acts as a mediator that translates easily measurable furnace temperature data into accurate predictions of wafer surface temperature, achieving high prediction accuracy without requiring complex measurement systems or hardware modifications.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention replaces complex physical measurement systems with a mathematical modeling approach. Instead of using sophisticated sensors or complex hardware to directly measure and predict wafer surface temperature, the system uses a computational model that processes furnace temperature data to achieve accurate predictions with simpler, more cost-effective means.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS20250291343A1Information processing apparatus, substrate processing apparatus, and information processing method

Publication Date: 2025.09.18 TOKYO ELECTRON LTD

AI summary

An information processing apparatus includes an acquisition unit that acquires measurement data including a first physical quantity indicating a state within a processing container for processing a processing target and a second physical quantity indicating a state of the processing target, a determination unit that determines a parameter of a model representing a relationship between the first physical quantity and the second physical quantity, based on the measurement data, and an optimization unit that optimizes a set value of the first physical quantity to minimize a time required for the second physical quantity to satisfy a target value, based on the model with the parameter determined by the determination circuitry set therein.