Substrate Chamber Gap Structure for Particle Reattachment Control
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Solution Overview
Problem
Existing substrate processing methods face challenges in suppressing the reattachment of particles to the substrate due to inefficient gas flow regulation, leading to incomplete particle removal and re-deposition.
Innovation Solution
The substrate processing apparatus incorporates a processing container with a plate and through-hole configuration that creates a narrower second gap between the plate and the substrate, a cylindrical body to manage gas flow within the nozzle storage, and a rectifying ring to regulate gas flow around the substrate's perimeter, ensuring efficient particle removal by controlling gas flow directions and preventing reattachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If gas is jetted to irradiate the substrate with a gas cluster for particle removal, then particle removal capability is improved, but backward gas flow causes detached particles to reattach to the substrate
Solution Approach 1:
The processing chamber is segmented into multiple regions by introducing a partition wall that divides the space above and below the substrate. This segmentation allows independent control of gas flow in each region, preventing backward flow from mixing with the forward-directed gas cluster flow, thereby eliminating particle reattachment while maintaining effective particle removal
Solution Approach 2:
A partition wall is introduced as an intermediary structure between the gas injection source and the substrate. This wall acts as a physical barrier that directs gas flow unidirectionally toward the substrate surface, preventing detached particles from being carried back by reverse flow, thus solving the reattachment problem while preserving particle removal efficiency
2Object-generated harmful factors
If a partition wall is introduced to prevent backward gas flow, then particle reattachment is suppressed, but device complexity increases
Solution Approach 1:
The partition wall is designed as a detachable component that can be removed or adjusted. This allows the system to operate in different modes - with the partition wall for high-precision particle removal applications, or without it for simpler operations - thereby reducing overall device complexity while maintaining the capability to suppress particle reattachment when needed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These design elements enhance the efficiency of particle removal by minimizing backward gas flow, increasing the discharge of detached particles, and reducing reattachment, thereby improving the cleanliness of the substrate surface.
Implementation Method 1
jetting a mixed gas consisting of a reactive gas (e.g., ClF3 gas) and an additive gas (e.g., Ar gas) from a nozzle outlet to a vacuum processing chamber to generate a reactive cluster by adiabatic expansion of the mixed gas
Implementation Method 2
a through-hole configured to pass through the opposing wall and the plate. The plate has a second opposing surface facing the first main surface of the substrate. The through-hole is a passage of the gas and has an outlet on the second opposing surface of the plate
Data Source
AI summary
A substrate processing apparatus includes: a processing container including a processing chamber; a holder configured to hold a substrate in the processing chamber; and a nozzle configured to jet a gas to irradiate a first main surface of the substrate with a gas cluster. The processing container includes an opposing wall including a first opposing surface facing the first main surface of the substrate, a plate provided on a portion of the first opposing surface, and a through-hole configured to pass through the opposing wall and the plate. The plate has a second opposing surface facing the first main surface. The through-hole is a passage of the gas and has an outlet on the second opposing surface. A first gap is formed between the opposing wall and the substrate. A second gap is formed between the plate and the substrate and is narrower than the first gap.