Substrate Transfer Gas Blowing for Supercritical Processing
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Solution Overview
Problem
In substrate processing techniques using a supercritical fluid, it is challenging to completely remove liquid adhering to the lower surface of substrates before they are carried into a processing chamber, leading to prolonged processing times and potential defective results due to residual liquid.
Innovation Solution
A method involving the formation of a liquid film on the upper surface of the substrate, followed by blowing a gas towards the lower surface after the film's formation to remove adhering liquid, thereby reducing the amount of liquid brought into the chamber and shortening the time required for its removal during supercritical processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is carried into the chamber while being placed on the support tray, then the substrate protection during conveyance is improved, but the liquid discharge time is prolonged and processing quality deteriorates
Solution Approach 1:
The gas blowing operation is performed in advance before the substrate is carried into the chamber. The gas discharger removes liquid from the lower surface of the substrate while it is still accessible outside the chamber, so that when the substrate enters the chamber, minimal liquid remains to interfere with the supercritical processing.
Solution Approach 2:
The liquid adhering to the lower surface of the substrate is extracted and removed using gas blowing before the substrate enters the chamber. This separates the liquid removal operation from the supercritical processing operation, allowing the liquid to be discharged in advance through a different mechanism (gas flow) rather than relying solely on the supercritical fluid to remove it later.
2Ease of operation
If the substrate is carried into the chamber with liquid on the lower surface, then the conveyance process is simplified, but the processing result quality deteriorates due to residual liquid
Solution Approach 1:
A gas discharger is introduced as an intermediary device between the substrate conveyance system and the chamber. This gas discharger acts as a mediator to remove liquid from the substrate's lower surface without requiring changes to the basic conveyance mechanism or support tray design, thus maintaining operational simplicity while improving processing quality.
Solution Approach 2:
The gas blowing operation is performed in advance before the substrate is carried into the chamber. The gas discharger removes liquid from the lower surface of the substrate while it is still accessible outside the chamber, so that when the substrate enters the chamber, minimal liquid remains to interfere with the supercritical processing.
3Device complexity
If no gas blowing is applied, then the device complexity is reduced, but the liquid removal efficiency deteriorates
Solution Approach 1:
The invention uses gas blowing (pneumatic method) to remove liquid from the substrate's lower surface. A gas discharger delivers gas flow to the lower surface of the substrate to blow off adhering liquid. This pneumatic approach is simpler than mechanical wiping or heating methods, adding minimal device complexity while achieving effective liquid removal.
Solution Approach 2:
The gas discharger is designed to directly blow gas onto the substrate's lower surface without requiring complex mechanical structures. The gas flow itself performs the liquid removal function, and the system leverages the existing substrate conveyance motion to facilitate the process, minimizing additional device complexity while maintaining high liquid removal efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the amount of liquid adhering to the substrate's lower surface, minimizing processing failures and enhancing processing efficiency by ensuring the substrate is largely free of liquid before entering the chamber.
Implementation Method 1
blowing a gas toward a lower surface of the substrate supported in a horizontal posture by a gas discharger
Implementation Method 2
processing a substrate by a processing fluid in a supercritical state in the chamber
Data Source
AI summary
A substrate processing method in accordance with the present invention includes forming a liquid film on an upper surface of a substrate by a wet processing apparatus; carrying the substrate having the liquid film formed thereon into a chamber of a supercritical processing apparatus by a conveyor device; and processing a substrate by a processing fluid in a supercritical state in the chamber by the supercritical processing apparatus. The method further includes blowing a gas toward a lower surface of the substrate supported in a horizontal posture by a gas discharger for at least a part of a period after the formation of the liquid film on the substrate during which the substrate is outside the chamber.