Vertical Substrate Gas Feed Control for Film Thickness Uniformity

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in achieving uniform film thickness across multiple substrates during simultaneous processing, particularly in vertical type substrate processing apparatuses where gas ejection ports are perpendicular to the processing surface.

Innovation Solution

A substrate processing apparatus is designed with a substrate retainer, reaction tube, heater, gas supplier, exhauster, and controller to adjust the relative position of substrates with respect to gas feeders, allowing for controlled gas supply to maintain uniform film thickness across multiple substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a slot-shaped gas ejection port is used to span multiple substrates, then gas can be supplied to multiple substrates simultaneously, but film thickness uniformity deteriorates

Engineering Contradiction:
ImprovethroughputVSAvoidfilm thickness uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The gas ejection port is divided into multiple independent gas feeders, each corresponding to a specific substrate position. This segmentation allows independent control of gas supply to each substrate, enabling simultaneous processing of multiple substrates while maintaining uniform film thickness through individualized gas flow regulation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The substrate retainer is made movable along the vertical direction, allowing dynamic adjustment of the relative position between substrates and gas feeders. This enables optimization of gas distribution and film thickness uniformity by adjusting substrate positions during the film formation process.

Inventive Principle:
Principle #15Dynamics

2Productivity

If substrates are processed simultaneously in a vertical arrangement, then productivity increases, but controlling individual substrate positions relative to gas feeders becomes complex

Engineering Contradiction:
ImprovethroughputVSAvoidposition control complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The substrate retainer serves multiple functions: it holds multiple substrates in vertical arrangement, provides movable positioning along the vertical axis, and enables simultaneous exposure of all substrates to gas supply. This multi-functionality simplifies the overall system by combining substrate holding and positioning capabilities in a single component.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The controller coordinates the movable substrate retainer and gas feeders to maintain optimal relative positions. By monitoring and adjusting positions dynamically, the system ensures that each substrate receives appropriate gas supply for uniform film formation, simplifying control through automated feedback mechanisms.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus improves film thickness uniformity by adjusting gas supply states and positions, ensuring consistent film formation on multiple substrates during simultaneous processing.

Implementation Method 1

a heater provided around the reaction tube and configured to heat the plurality of substrates

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

a gas supplier provided with a plurality of gas feeders corresponding to the plurality of substrates, respectively, supported by the substrate retainer accommodated in the reaction tube

Methodology Applied
Scientific EffectGas flow:

Implementation Method 3

an exhauster through which a gas supplied through the gas supplier is exhausted from the reaction tube

Methodology Applied
Scientific EffectPressure gradient: Pressure Gradient

Implementation Method 4

a reaction tube in which the substrate retainer supporting the plurality of substrates is accommodated

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS12540399B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
Publication Date: 2026.02.03 KOKUSAI DENKI KK
  • US12540399B2 patent drawing
  • US12540399B2 patent drawing
  • US12540399B2 patent drawing

AI summary

According to the technique of the present disclosure, there is provided a substrate processing apparatus capable of improving thickness uniformity of a film formed on each substrate. The apparatus includes a substrate retainer; a reaction tube; a vertical driver for moving the substrate retainer into or out of the reaction tube; a heater provided around the reaction tube; a gas supplier having a plurality of gas feeders corresponding to a plurality of substrates, respectively, supported by the substrate retainer; an exhauster through which a gas is exhausted from the reaction tube; and a controller capable of controlling the vertical driver and the gas supplier such that the gas is capable of being supplied through the plurality of gas feeders while maintaining a relative position of a substrate with respect to a gas feeder corresponding thereto at a first position or at a second position different from the first position.