Substrate Gas Nozzle Flow Rectification for Uniform Mist Protection
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Solution Overview
Problem
Existing substrate processing apparatuses struggle to uniformly distribute a gas from a discharge port radially across the substrate surface, leading to inadequate protection against liquid droplets and mist.
Innovation Solution
A substrate processing apparatus with a fluid nozzle that includes a gas discharge port and a gas flow passage. The gas flow passage features a gas retaining portion with a larger cross-sectional area and a rectifying structure that adjusts the gas flow direction, enhancing uniformity and radial spread of the gas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If gas is discharged radially from the center side toward the peripheral edge side, then the substrate surface can be protected from liquid droplets and mist, but the uniformity of gas spread is insufficient
Solution Approach 1:
The gas flow passage is segmented into multiple functional sections: a gas supply section, a gas retaining portion with larger cross-sectional area, and a discharge section. This segmentation allows the gas flow to be controlled and uniformized as it progresses from the center toward the periphery, ensuring even distribution while maintaining protective coverage.
Solution Approach 2:
The cross-sectional area of the gas flow passage is changed along its length, with the gas retaining portion having a larger area than the discharge section. This parameter change reduces gas flow velocity in the retaining portion, preventing turbulence and ensuring uniform radial spread of gas across the substrate surface.
2Object-affected harmful factors
If gas flow speed is increased to improve coverage, then protection effectiveness is enhanced, but flow speed difference across the substrate surface increases
Solution Approach 1:
The gas flow passage design creates a dynamic flow control system where the varying cross-sectional area naturally regulates gas velocity. The gas retaining portion acts as a buffer that slows down the gas flow, while the gradual transition to the discharge section ensures smooth, uniform gas ejection across the substrate surface without creating hotspots or dead zones.
Solution Approach 2:
The gas retaining portion serves as an intermediary chamber between the gas supply and the discharge port. This intermediate section allows excess gas pressure and velocity to be dissipated and redistributed, ensuring that the gas reaches the substrate surface with uniform velocity and optimal protective coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved gas distribution ensures uniform protection of the substrate surface by reducing flow speed differences and enhancing the radial spread of the gas, effectively preventing liquid droplets and mist from adhering.
Implementation Method 1
the gas supplied to the gas retaining portion is dispersed in the gas retaining portion. Therefore, flow speed of the gas supplied into the gas retaining portion is reduced
Implementation Method 2
the gas in the gas flow passage is rectified by the rectifying structure provided in the portion of the gas flow passage different from the gas retaining portion. Thereby, the moving direction of the gas in the gas flow passage is adjusted to the direction toward the gas discharge port
Data Source
AI summary
A substrate processing apparatus includes a spin chuck that holds a substrate, and a fluid nozzle disposed to face a principal surface of the substrate which is held by the spin chuck. The fluid nozzle includes a gas discharge port from which a gas is discharged radially from the center side of the principal surface of the substrate to the peripheral edge side, and a gas flow passage through which the gas is supplied to the gas discharge port, the gas flow passage having a tubular shape along an intersecting direction with respect to the principal surface of the substrate. The gas flow passage has a gas retaining portion whose flow passage cross-sectional area is larger than other portions of the gas flow passage, and a rectifying structure provided in a portion of the gas flow passage different from the gas retaining portion, the rectifying structure that rectifies a flow of the gas in the gas flow passage.