Substrate Processing Device Gas Supply for Oxidation Control
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Solution Overview
Problem
There is a demand for further reducing substrate oxidation during processing and conveying in semiconductor manufacturing, as existing methods are insufficient in maintaining a low oxygen environment within the chamber, particularly during substrate movement.
Innovation Solution
A substrate processing device and method that utilize a combination of gas supply systems, including a first gas supply part for processing and a second gas supply part, which is different from oxygen and oxygen allotropes, to control oxygen concentration within the chamber. The second gas is supplied from specific positions during substrate processing and conveyance to maintain a low oxygen environment, using an air feeding port part positioned above and outward of the substrate holding part.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a blocking member with downward ejection port is used to fill space between substrate and blocking member with inert gas, then oxygen concentration in atmosphere contact with substrate is decreased, but oxidation during substrate conveyance inside chamber cannot be sufficiently prevented
Solution Approach 1:
The gas supply system is segmented into multiple independent gas supply parts (first gas supply part with downward ejection port, second gas supply part with air feeding port part) that can operate at different locations and times. This segmentation allows targeted oxygen exclusion during both substrate processing and conveyance operations, resolving the contradiction by providing specialized protection for each phase.
Solution Approach 2:
The second gas supply part supplies inert gas in advance during substrate conveyance before the substrate reaches the processing position. This preliminary action ensures that the chamber atmosphere is already low in oxygen before substrate conveyance begins, preventing oxidation during the conveyance phase that wasn't addressed by the blocking member alone.
2Object-affected harmful factors
If multiple gas supply systems are added to prevent oxidation during conveyance, then substrate protection is improved, but device complexity increases
Solution Approach 1:
The first and second gas supply parts, while serving different primary functions (downward ejection for processing, air feeding for conveyance), both contribute to oxygen exclusion and substrate protection. This multi-functionality reduces the need for completely separate systems, managing complexity while maintaining effective protection during both processing and conveyance phases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces oxygen concentration within the chamber, thereby curbing substrate oxidation during processing and conveyance, ensuring a stable low-oxygen environment for improved semiconductor manufacturing outcomes.
Implementation Method 1
The second gas supply part is contained in the chamber and supplies a second gas to an inside of the chamber
Implementation Method 2
The first gas supply part is disposed in the top wall part and supplies a first gas toward a side on which the substrate holding part is positioned
Data Source
AI summary
A substrate processing device is provided. A chamber has a side wall part and a top wall part and contains a substrate holding part. A first gas supply part is disposed in the top wall part and supplies a first gas toward a side on which the substrate holding part is positioned. A second gas supply part is contained in the chamber and supplies a second gas to an inside of the chamber. A control unit controls the first and second gas supply part. The second gas is a gas different from oxygen and an allotrope of oxygen. The second gas supply part has an air feeding port part which is positioned on an upward side of a holding position of a substrate by the substrate holding part in a vertical direction and is positioned on an outward side of the substrate holding part in a horizontal direction.