Substrate Gas Supply Switching for Precise Photoresist Adhesion
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Solution Overview
Problem
Current substrate processing methods face challenges in achieving precise and stable gas supply for improving photoresist adhesion, leading to potential undercuts during etching and waste of chemical solutions due to leakage.
Innovation Solution
A substrate processing apparatus and method that incorporates a gas supply unit capable of selectively using either a bubbling or blowing method to vaporize chemical solutions, preventing leakage and ensuring accurate gas delivery by including both a bubbler and a blower to prevent liquid splashing and optimize vaporization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a bubbling method is used to vaporize chemical solution, then vaporization efficiency is improved, but liquid splashing and leakage occur
Solution Approach 1:
A hydrophobic coating is applied to the inner surface of the bubbling apparatus as an intermediary layer. This coating allows gas bubbles to pass through efficiently for vaporization while preventing liquid chemical solution from splashing or leaking out, thus resolving the contradiction between vaporization efficiency and liquid containment
Solution Approach 2:
The invention uses a carrier gas (nitrogen or oxygen) as an intermediary medium to transport the vaporized chemical solution to the substrate. The carrier gas copies the vaporization function while preventing direct contact and potential leakage of the chemical solution, achieving both efficient vaporization and leakage prevention
2Object-generated harmful factors
If a blowing method is used to vaporize chemical solution, then liquid leakage is prevented, but vaporization efficiency decreases
Solution Approach 1:
The chemical solution is pre-heated before being introduced to the blowing apparatus. This preliminary heating action increases the vaporization efficiency of the chemical solution during the blowing process, compensating for the generally lower efficiency of the blowing method while maintaining leakage prevention
Solution Approach 2:
The invention changes physical parameters such as temperature, pressure, and gas flow rate to optimize the blowing method. By controlling these parameters, the system achieves sufficient vaporization efficiency while maintaining the advantage of preventing liquid leakage through the blowing method
3Productivity
If photoresist adhesion is not properly improved, then processing speed is maintained, but undercut defects occur during etching
Solution Approach 1:
The system incorporates sensors and control mechanisms to monitor the adhesion improvement process in real-time. Based on feedback from the monitoring system, the vaporization parameters (temperature, gas flow rate, chemical solution concentration) are automatically adjusted to ensure optimal adhesion quality while maintaining processing speed
Solution Approach 2:
The invention dynamically adjusts process parameters such as temperature, pressure, and chemical solution concentration during the adhesion improvement process. By optimizing these parameters, the system achieves both high processing speed and excellent adhesion quality, preventing undercut defects without sacrificing productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for stable and precise supply of processing gases, enhancing photoresist adhesion and reducing chemical solution waste, thereby improving the efficiency of substrate processing.
Implementation Method 1
a support unit configured to support a substrate within the processing space and to include a heating member
Implementation Method 2
a gas supply unit configured to supply a processing gas to the processing space and to vaporize a processing fluid in a liquid state
Data Source
AI summary
Proposed is a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes a process chamber configured to have a processing space therein, a support unit configured to support a substrate within the processing space, a gas supply unit configured to supply a processing gas to the processing space, and an exhaust unit configured to exhaust the processing space, wherein the gas supply unit may vaporize a processing fluid in a liquid state by using at least one of a bubbling method and a blowing method and supply the processing fluid to the processing space.