Substrate Chamber Gas Switching for Fast Pressure Stabilization
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Solution Overview
Problem
In substrate processing apparatuses, the time required for replacing processing gases affects throughput, leading to process fluctuations and particle generation due to gas mixing, and the conductance of pipes with dead ends hinders gas replacement, causing delays in pressure control.
Innovation Solution
A substrate processing apparatus with a partition plate having gas passing holes connecting the processing and exhaust chambers, a measuring instrument, and a controller that controls a valve to quickly replace gases by routing them through a bypass path, ensuring efficient gas switching and pressure control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If gas replacement is performed through conventional pipes with dead ends, then the measuring instrument can monitor pressure, but the conductance is hindered and gas replacement is delayed
Solution Approach 1:
The gas replacement path is segmented into two separate paths: one path (through the partition plate with gas passing holes) maintains high conductance for rapid gas replacement, while the other path (through the measuring instrument) provides pressure monitoring. This segmentation allows each path to be optimized for its specific function without compromising the other.
Solution Approach 2:
The partition plate acts as an intermediary structure that facilitates gas flow between chambers while allowing the measuring instrument to monitor pressure independently. The gas passing holes in the partition plate provide a dedicated high-conductance path that mediates between the need for rapid gas replacement and pressure measurement capabilities.
2Productivity
If gas replacement time is reduced to improve throughput, then productivity increases, but gas mixing occurs causing process fluctuations and particle generation
Solution Approach 1:
The gas replacement process is segmented into controlled phases using the dual-path configuration. The high-conductance path enables rapid gas replacement when needed, while the measuring instrument connected through the other path provides real-time pressure monitoring to detect and prevent gas mixing, ensuring process stability is maintained even during fast transitions.
3Measurement precision
If conventional pipe configuration is used for pressure measurement, then the measuring instrument can be connected, but gas replacement is delayed affecting pressure control
Solution Approach 1:
The pressure measurement and gas replacement functions are segmented into separate paths. The measuring instrument is connected through a dedicated path that does not impede the high-conductance gas replacement path, eliminating the time delay that would occur if the measuring instrument were in series with the gas replacement flow.
Data Source
AI summary
A substrate processing apparatus includes: a processing chamber configured to execute a processing on a substrate by an introduced gas; an exhaust chamber configured to exhaust a gas existing in the processing chamber; a partition plate having a plurality of gas passing holes for bringing the processing chamber and the exhaust chamber into communication with each other therethrough; a measuring instrument configured to measure a state in the processing chamber; a first pipe configured to connect the processing chamber and the measuring instrument; a second pipe configured to bring the exhaust chamber and the measuring instrument into communication with each other therethrough via a first valve; and a controller, wherein the controller is configured to control the substrate processing apparatus so as to control the first valve.