Substrate Chamber Gas Zoning for Uniform Flash Processing

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing substrate processing apparatuses face challenges in uniformly processing multiple substrates due to vertical heat transfer reduction configurations, leading to inconsistencies in processing results.

Innovation Solution

A substrate processing apparatus with a process chamber that includes separate regions for gas supply and exhaust, controlled by a controller to maintain a reduced pressure difference, ensuring uniform gas flow and pressure distribution across substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a heat insulating assembly is arranged below the substrate retainer to reduce vertical heat transfer, then heat loss is reduced, but processing uniformity across substrates deteriorates

Engineering Contradiction:

Improveheat lossVSAvoidprocessing uniformity

Core Design Contradiction:

Loss of energyVSManufacturing precision

Solution Approach 1:

The process chamber is divided into multiple regions with independent gas supply systems. The gas supply device includes multiple gas supply ports positioned at different locations and heights, allowing separate control of gas flow to different substrate regions. This segmentation enables independent optimization of processing conditions for each substrate, resolving the uniformity issue caused by the heat insulating assembly.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the process chamber are provided with tailored gas supply conditions. The gas supply device can deliver process gas with different flow rates, pressures, or compositions to different substrate positions. This local quality approach compensates for the non-uniform temperature distribution created by the heat insulating assembly, ensuring each substrate receives appropriate processing conditions.

Inventive Principle:

Principle #3Local quality

2Productivity

If multiple substrates are processed collectively in a substrate retainer, then productivity is improved, but processing uniformity deteriorates due to vertical heat transfer reduction

Engineering Contradiction:

Improvebatch processing capabilityVSAvoidsubstrate-to-substrate uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The gas supply system is segmented into multiple independent channels, each capable of delivering gas to specific substrate positions within the batch. This allows individualized process control for each substrate while maintaining batch processing efficiency, overcoming the uniformity limitations imposed by the heat insulating assembly.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Gas supply is implemented not only horizontally but also vertically through gas supply ports at different heights. This multi-dimensional gas distribution approach ensures uniform process conditions across substrates arranged in vertical stacks, compensating for the reduced vertical heat transfer caused by the heat insulating assembly.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Speed

If gas is supplied in a flash-like manner to the process chamber, then processing speed is improved, but pressure difference between regions increases

Engineering Contradiction:

Improvegas supply speedVSAvoidpressure difference

Core Design Contradiction:

SpeedVSStress or pressure

Solution Approach 1:

The gas supply is divided into multiple simultaneous or sequential pulses delivered through different ports. This segmented flash supply distributes the pressure increase across multiple regions, preventing excessive pressure differences while maintaining high overall supply speed for rapid processing.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Gas supply is performed in controlled periodic pulses rather than continuous flow. The timing and duration of each pulse are optimized to achieve rapid gas replacement (flash-like effect) while allowing pressure to equalize between regions during intervals, reducing overall pressure differences in the system.

Inventive Principle:

Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances processing uniformity and productivity by maintaining consistent gas flow and pressure across multiple substrates, improving the quality and consistency of substrate processing.

Implementation Method 1

a pressure difference between the first region and the second region is reduced when the first gas is supplied in a flash-like manner

Methodology Applied

Scientific EffectPressure difference: Pressure Gradient

Data Source

PatentUS20260015720A1Substrate Processing Apparatus, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium

Publication Date: 2026.01.15 KOKUSAI DENKI KK

AI summary

There is provided a technique that includes: a process chamber in which a substrate is processed; a first gas supplier configured to supply a first gas to a first region in the process chamber; a second gas supplier configured to supply a second gas to a second region in the process chamber different from the first region; and a controller configured to be capable of controlling the first gas supplier and the second gas supplier to supply the first gas and the second gas such that a pressure difference between the first region and the second region is reduced when the first gas is supplied in a flash-like manner.