Substrate Gripper Distortion Sensing for Stable Transfer
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Solution Overview
Problem
Existing substrate transfer devices face issues with defective gripping, leading to substrate dropping during transfer, as they rely on detecting predetermined gripping torque and position, which may not accurately determine stable substrate engagement.
Innovation Solution
A substrate transfer device equipped with a support part, gripping part, detection parts, and a determination part that analyze distortion amounts from sensors to assess the gripping situation, ensuring stable engagement by comparing waveforms of distortion data to detect defective gripping and abnormal transfer conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If gripping is detected based on predetermined torque and position, then the detection process is simple, but the accuracy of gripping state determination is insufficient
Solution Approach 1:
The patent replaces traditional mechanical detection methods (torque sensors and position sensors) with distortion waveforms analysis. By monitoring the distortion amounts of contact portions during the gripping process and analyzing the temporal changes in these distortions, the system can determine gripping state with higher accuracy without requiring complex mechanical detection systems.
Solution Approach 2:
The patent changes the detection parameter from static torque and position values to dynamic distortion waveforms. By analyzing the time-varying distortion amounts of contact portions during the gripping process, the system captures the dynamic characteristics of substrate engagement, enabling more accurate determination of gripping state through waveform pattern recognition.
2Reliability
If traditional torque and position detection is used, then the device structure is simple, but substrate dropping occurs due to defective gripping
Solution Approach 1:
The patent replaces traditional mechanical detection methods (torque sensors and position sensors) with distortion waveforms analysis. By monitoring the distortion amounts of contact portions during the gripping process and analyzing the temporal changes in these distortions, the system can determine gripping state with higher accuracy without requiring complex mechanical detection systems.
Solution Approach 2:
The patent implements a feedback mechanism where distortion waveforms from contact portions are continuously monitored and analyzed. The determination part uses the detected distortion amounts to identify gripping abnormalities and can issue warnings or stop the transfer process, creating a closed-loop feedback system that prevents substrate dropping by responding to defective gripping conditions.
3Measurement precision
If multiple detection parts are added to monitor contact portions, then gripping detection accuracy improves, but device complexity increases
Solution Approach 1:
The patent replaces traditional mechanical detection methods (torque sensors and position sensors) with distortion waveforms analysis. By monitoring the distortion amounts of contact portions during the gripping process and analyzing the temporal changes in these distortions, the system can determine gripping state with higher accuracy without requiring complex mechanical detection systems.
Solution Approach 2:
The distortion detection parts integrated into the contact portions serve multiple functions: they detect both the presence of substrate engagement and the quality of gripping simultaneously. By analyzing the distortion waveforms, the system can identify various gripping states (normal gripping, defective gripping, substrate absence) using a single detection mechanism, reducing the need for multiple specialized sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively detects defective gripping and transfer abnormalities, preventing substrate dropping by accurately determining the gripping state through distortion analysis, thereby ensuring stable substrate transfer and operational reliability.
Implementation Method 1
a plurality of detection parts provided in the plurality of contact portions, respectively, and configured to detect distortion amounts of the plurality of contact portions
Data Source
AI summary
A substrate transfer device includes: a support part configured to support a substrate to be transferred and provided with a plurality of engagement portions which are engaged with an edge of the substrate on a first side of the substrate; a gripping part configured to move toward or away from the plurality of engagement portions and provided with a plurality of contact portions which come into contact with the edge of the substrate on a second side of the substrate when moving toward the plurality of engagement portions; a plurality of detection parts provided in the plurality of contact portions, respectively, and configured to detect distortion amounts of the plurality of contact portions; and a determination part configured to determine a gripping situation of the substrate based on detection results obtained by the plurality of detection parts.