Substrate Gripper Reorientation for Low-Contamination Wet Processing
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Solution Overview
Problem
Existing substrate treatment methods face challenges such as pattern leaning due to high aspect ratio patterns and water mark generation during rapid drying, especially in batch-type treatments, which require large spaces and lead to contamination from actuating unit friction.
Innovation Solution
An apparatus and method that includes a gripping unit, a body, and an actuating unit with horizontal and rotation capabilities to change the posture of substrates between vertical and horizontal positions within a treatment bath, minimizing immersion of the actuating unit in the liquid to reduce contamination and space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrates are changed from vertical to horizontal posture in treatment bath, then water mark generation is prevented and substrate wettability is maintained, but treatment bath size increases and particles are generated from actuating unit friction
Solution Approach 1:
The actuating unit is extracted from the treatment bath environment. The gripping unit with substrates is moved out of the treatment liquid to a position above the bath for posture changing, then returned to the bath. This separates the contamination-generating actuation process from the clean treatment environment, allowing posture changes without generating particles in the treatment liquid.
Solution Approach 2:
A transfer path or intermediate position above the treatment bath serves as a mediator between the vertical and horizontal posture positions. The gripping unit moves substrates through this intermediate zone for posture changing, preventing direct contact between actuating components and treatment liquid, thus avoiding particle generation while maintaining substrate wettability.
2Productivity
If batch-type treatment method is used to treat multiple substrates, then productivity is improved, but pattern leaning occurs in high aspect ratio patterns and water marks may form during drying
Solution Approach 1:
The substrate posture is dynamically changed from vertical to horizontal during the treatment process. This dynamic adjustment allows batch treatment of multiple substrates while preventing pattern leaning by maintaining horizontal orientation during critical treatment phases, and prevents water marks by controlling the drying process in horizontal position.
Solution Approach 2:
The orientation parameter of substrates is changed from vertical to horizontal position. This parameter change prevents pattern leaning in high aspect ratio patterns by eliminating gravitational distortion forces, while still allowing batch processing of multiple substrates to maintain high productivity.
3Volume of stationary object
If vertical posture treatment is used for substrates, then treatment bath size is minimized, but pattern leaning is generated in high aspect ratio patterns
Solution Approach 1:
The substrate posture is dynamically adjusted based on treatment requirements. Substrates are held in vertical position during immersion to minimize bath size, then changed to horizontal position during drying or sensitive treatment phases to prevent pattern leaning, optimizing both space utilization and pattern quality.
Data Source
AI summary
The present invention provides an apparatus of processing a substrate. The apparatus of processing a substrate includes: a gripping unit gripping a plurality of substrates on both sides; a body supporting the gripping unit; an actuating unit moving and rotating the gripping unit with respect to the body; and a control unit controlling the actuating unit, wherein the actuating unit includes: a horizontal actuating unit horizontally moving the gripping unit in a first direction with respect to the body; a rotation actuating unit rotating the gripping unit with respect to the body.