Light-Emitting Substrate Groove Layout for Precise Pad Ink Coating
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Solution Overview
Problem
The existing ink coating processes for Mini-LED products struggle with accuracy, leading to solder resist ink overflow onto pads, resulting in poor soldering or soldering failures during the subsequent soldering process with LED chips.
Innovation Solution
A manufacturing method for a light-emitting substrate that involves forming a groove around the pad assembly on the base plate, allowing the solder resist ink to be applied in a way that it automatically flows into the groove, forming a second ink layer close to the pad, thereby reducing the distance between the ink and the pad and enhancing coating accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the accuracy of coating the solder resist ink is improved by reducing the distance between the ink and pad, then the coating precision is improved, but the solder resist ink overflows onto the pad causing poor soldering
Solution Approach 1:
The patent divides the coating area into two distinct zones: a first coating area surrounding the pad at a first distance, and a second coating area closer to the pad at a second distance smaller than the first distance. This segmentation allows different coating accuracies in different regions, achieving high overall precision without ink overflow onto the pad.
Solution Approach 2:
The patent applies different coating distances locally: the first ink layer is coated at a first distance from the pad periphery, while the second ink layer is coated at a second distance smaller than the first distance. This local quality variation enables the ink to be closer to the pad in critical areas without causing overflow, resolving the contradiction between precision and soldering quality.
2Manufacturing precision
If the solder resist ink is coated closer to the pad to improve accuracy, then the coating precision is improved, but the ink covers the pad surface causing soldering failure
Solution Approach 1:
The patent segments the ink coating into two layers with different distances from the pad. The first ink layer is positioned at a first distance from the pad periphery, while the second ink layer is positioned at a second distance smaller than the first distance. This segmentation allows the ink to achieve high coating accuracy close to the pad without causing harmful overflow onto the pad surface.
Solution Approach 2:
The first ink layer acts as an intermediary between the pad and the second ink layer. It is coated at a first distance from the pad periphery, creating a buffer zone that prevents the second ink layer (which is closer to the pad) from overflowing onto the pad surface, thus eliminating the harmful effect of ink overflow.
3Manufacturing precision
If the distance between solder resist ink and pad is reduced to improve accuracy, then the coating precision is improved, but poor soldering or soldering failure occurs
Solution Approach 1:
The patent segments the ink coating structure into two layers: the first ink layer at a first distance from the pad periphery and the second ink layer at a second distance smaller than the first distance. This segmentation enables high coating accuracy while maintaining soldering reliability by preventing the ink from covering the pad surface.
Solution Approach 2:
The patent applies local quality by positioning the first ink layer at a first distance from the pad and the second ink layer at a second distance closer to the pad. This local variation in coating distance achieves high precision in critical areas while maintaining adequate clearance to prevent soldering failures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the accuracy of ink coating, prevents overflow, and avoids poor soldering or soldering failures, ensuring high reflectivity for backlight products and enhanced contrast for direct display products, while maintaining simplicity and low production costs.
Implementation Method 1
a groove is formed on the mounting surface of the base plate, wherein the groove is defined in a periphery of the pad assembly; a solder resist ink is applied on the mounting surface of the base plate in a periphery of the groove to form a solder resist ink layer, wherein the solder resist ink layer includes a first ink layer located in the periphery of the groove and a second ink layer located in the groove
Data Source
AI summary
A light-emitting substrate and a manufacturing method thereof are disclosed. In the embodiment of the present disclosure, by providing a groove on a base plate in the manufacturing method of the light-emitting substrate, the accuracy of coating the solder resist ink layer can be improved so as to reduce a distance between the solder resist ink layer and the pad assembly and avoid poor soldering or soldering failure caused by the overflow of the solder resist ink onto the pad.