Semiconductor Package Substrate Groove Resin Etching Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for manufacturing semiconductor package substrates are complex and suffer from precision issues due to the need for precise alignment of upper and lower patterns, which complicates the process and reduces manufacturing yield.
Innovation Solution
A method involving the formation of grooves on a conductive base substrate, filling these grooves with resin, and etching the opposite surface to expose the resin, eliminating the need for precise pattern alignment and simplifying the manufacturing process by using etchants like copper chloride or ferric chloride.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photoresist patterning is used to pattern upper and lower copper foils, then electrical connections can be established, but the manufacturing process becomes complicated and alignment precision is reduced
Solution Approach 1:
The invention extracts and eliminates the photoresist patterning step from the manufacturing process. Instead of using photoresist to define patterns on both upper and lower surfaces, the method uses direct etching of the base substrate to form through-holes, removing the complex photoresist application, exposure, and development steps while maintaining reliable electrical connections through the through-holes
Solution Approach 2:
The invention performs preliminary action by pre-forming the through-hole patterns in the base substrate before copper foil lamination. The grooves are etched into the base substrate in advance, copper foils are then laminated over these pre-formed grooves, and finally the grooves are filled with conductive material to establish electrical connections, eliminating the need for subsequent photoresist patterning
2Reliability
If photoresist patterning is used for copper foil pattern formation, then electrical connections can be established, but manufacturing precision is reduced due to alignment difficulties
Solution Approach 1:
The invention removes the photoresist patterning process entirely, eliminating the alignment precision problems associated with matching upper and lower patterns. The through-holes are formed by direct etching of the base substrate, which provides inherent alignment reference, and copper foils are laminated and connected through these pre-formed holes without requiring precise photoresist alignment
Solution Approach 2:
The base substrate serves itself as the alignment reference by having through-holes directly etched into it. The grooves formed in the base substrate automatically provide the positioning and alignment function that would otherwise require complex photoresist alignment procedures, making the process self-aligning and eliminating alignment precision issues
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, increases yield, and ensures precise electrical connections between upper and lower surfaces without the need for complex alignment, resulting in a more efficient and reliable semiconductor package substrate production.
Implementation Method 1
etching another surface of the base substrate to expose the resin filling the first groove. In the etching of the other surface of the base substrate, a whole surface of the other surface of the base substrate may be etched
Data Source
AI summary
A method of manufacturing a semiconductor package substrate has a simplified process and an upper and lower pattern alignment problem is solved. A semiconductor package substrate is manufactured by the method. The method of manufacturing a semiconductor package substrate includes forming a first groove in one surface of a base substrate of a conductive material, filling the first groove with resin, and etching another surface of the base substrate to expose the resin filling the first groove.