Light Emitting Substrate Groove Segmentation Ion Migration
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Solution Overview
Problem
The existing substrates for light emitting elements face issues with ion migration between electrically-conductive layers, leading to short circuits and malfunction or failure of the light emitting devices, particularly as the distance between these layers decreases.
Innovation Solution
A substrate design featuring a resin layer with groove portions that separates electrically-conductive layers, incorporating fiber bundles that extend across these regions, thereby increasing the distance between them and reducing the likelihood of ion migration, along with a method of producing such substrates using a metal plate and pre-preg combination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the distance between electrically-conductive layers is decreased to reduce device size, then device miniaturization is achieved, but ion migration occurs causing short circuits and device failure
Solution Approach 1:
The patent divides the conductive layers into multiple segments by introducing groove portions between adjacent conductive layers. This segmentation increases the effective distance and path length for ion migration, preventing short circuits while maintaining compact overall device dimensions. The groove portions create physical barriers that segment the migration path between positive and negative electrodes.
Solution Approach 2:
The patent introduces groove portions that extend in the thickness direction of the substrate, adding a vertical dimension to the isolation structure. This dimensional approach creates deeper separation between conductive layers, increasing the ion migration path length without significantly increasing the planar footprint of the device.
2Reliability
If groove portions are introduced to prevent ion migration, then short circuit resistance is improved, but substrate structural integrity may be compromised
Solution Approach 1:
The patent uses composite material structures where the substrate comprises multiple layers including resin layers and fiber bundles. The fiber bundles act as reinforcement elements that compensate for the structural weakening caused by groove portions, maintaining overall substrate integrity while enabling effective ion migration prevention through the grooves.
Solution Approach 2:
The groove portions are strategically positioned only in specific regions where ion migration is most likely to occur between adjacent conductive layers, rather than uniformly across the entire substrate. This localized approach prevents short circuits where needed while minimizing the impact on overall substrate strength.
Data Source
AI summary
A substrate for light emitting elements includes: a resin layer having a sheet shape, a first surface, and a second surface located opposite to the first surface. The second surface has one or more groove portions that includes a first groove portion. The second surface is divided by the first groove portion into a plurality of regions that include the first region and the second region. The resin layer includes a plurality of fiber bundles and a resin. The substrate includes a first electrically-conductive layer located in the first region of the resin layer; and a second electrically-conductive layer located in the second region of the resin layer. In a plan view, the at least one continuous fiber bundle extends inside the resin layer across the first region, a portion below the first groove portion, and the second region.