Electronic Substrate Grounding via Segmented Copper Foil
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Solution Overview
Problem
High-density mounting of electronic components on substrates poses a challenge in efficiently utilizing copper foil for grounding without impeding the ground function, especially as the proportion of copper foil surface area in screw fastening portions increases with higher component density.
Innovation Solution
The implementation of a structure where copper foil portions are used for grounding, with solder portions and electrical wiring lines positioned to maintain grounding while allowing for higher mounting density by ensuring the copper foil test land portions are non-contact with screws, allowing for electrical wiring lines to be placed in under-screw-head regions and using bonding agents for insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper foil surface area is increased in screw fastening portions for grounding, then grounding function is improved, but mounting density of electronic components deteriorates
Solution Approach 1:
The copper foil in the screw fastening portion is divided into multiple separate copper foil portions rather than a continuous large area. This segmentation allows screws to be positioned between the copper foil portions, enabling both adequate grounding through multiple contact points and sufficient space for high-density component mounting.
2Productivity
If component density is increased on electronic substrate, then productivity is improved, but copper foil utilization for grounding deteriorates
Solution Approach 1:
The copper foil is strategically positioned only in specific local areas where grounding is needed, rather than occupying large continuous areas. This local quality approach ensures adequate grounding function while maximizing the available space for high-density component mounting in other areas of the substrate.
3Reliability
If copper foil portions are positioned under screw heads, then grounding is ensured, but electrical shorts may occur with wiring lines
Solution Approach 1:
An insulating structure is introduced as an intermediary between the copper foil portions and the screw heads. This insulating structure prevents direct electrical contact between the grounded copper foil and the screw heads, eliminating the risk of electrical shorts while maintaining the grounding function through the copper foil portions.
Data Source
AI summary
According to one embodiment, an electronic device is provided with: an electronic substrate on which electronic components are provided; a screw including a screw head portion and a threaded portion, and configured to be engaged to the electronic substrate; a conducting member provided between the screw head portion and the electronic substrate and configured to electrically connect the screw head portion and the electronic substrate; and an electrical wiring line provided between the screw head portion and the electronic substrate and configured so as not to be electrically connected to the screw head portion.