Substrate Guide Mechanism for Close-Gap Cleaning Accuracy

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Solution Overview

Problem

Conventional substrate processing apparatuses struggle to maintain a precise distance between the substrate and the top board, leading to issues such as radicals flowing into the substrate center, film peeling, and contamination due to contact with the top board during lifting and lowering.

Innovation Solution

Incorporation of a guide mechanism on the top board that allows the substrate to make contact with a guide mechanism, narrowing the distance to less than 0.5 mm, and using a buffer member to absorb impact, preventing radicals from flowing into the substrate center and reducing particle generation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the distance between substrate and top board is reduced to improve cleaning accuracy, then cleaning accuracy is improved, but substrate contact with top board causes contamination and film peeling

Engineering Contradiction:

Improvecleaning accuracyVSAvoidcontamination and film peeling

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

A guide mechanism is introduced as an intermediary component between the substrate and top board. The guide mechanism includes a guide plate with a guide groove that guides the substrate edge, allowing the substrate to approach the top board closely for improved cleaning accuracy while preventing direct contact between substrate and top board, thus avoiding contamination and film peeling.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If lifting/lowering mechanism is used to adjust substrate position, then positioning flexibility is improved, but substrate contact with top board during movement causes particle generation

Engineering Contradiction:

Improvepositioning flexibilityVSAvoidparticle generation

Core Design Contradiction:

Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The guide mechanism serves as a mediator during substrate lifting and lowering operations. The guide groove constrains substrate movement along a controlled path, enabling flexible positioning while preventing uncontrolled contact between substrate and top board that would generate particles.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The guide mechanism is positioned and configured in advance to provide protective guidance before substrate contact issues can occur. The guide plate and groove structure pre-establish protective constraints that prevent harmful contact during dynamic operations.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If distance between substrate and top board is increased to prevent contact, then substrate protection is improved, but cleaning accuracy deteriorates

Engineering Contradiction:

Improvesubstrate protectionVSAvoidcleaning accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The guide mechanism enables a compromise configuration where the substrate is positioned close to the top board for high cleaning accuracy while the guide groove prevents direct contact, thus maintaining both substrate protection and cleaning accuracy simultaneously.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20260011544A1Substrate processing apparatus and substrate processing method

Publication Date: 2026.01.08 TOKYO ELECTRON LTD

AI summary

A substrate processing apparatus cleans a substrate. The substrate processing apparatus includes a processing container, a stage, a top board, a lifting/lowering mechanism, and a guide mechanism. The stage is located inside the processing container and configured to support the substrate. The top board faces the stage. The lifting/lowering mechanism is configured to lift and lower the substrate. The guide mechanism is located on the top board and configured to bring the substrate into contact therewith.