Substrate Handler Gas Outlet for Oxide Inhibition
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Solution Overview
Problem
Current substrate processing systems face challenges in preventing degradation and contamination of film layers during substrate transfer, particularly due to oxidation and unwanted contamination from residual gases and particles in vacuum transfer chambers, which requires high gas flows and large capacity vacuum pumps, increasing costs and complexity.
Innovation Solution
A substrate handling robot with a housing and gas outlet system that directs a localized gas, such as inert or reactive gases, onto the substrate during transfer, using baffles to create a protective flow path and prevent oxidation and contamination, while utilizing a flexible tube connected to a gas source for efficient gas delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high gas flows are used to dilute oxygen or water vapor content, then oxide formation and dielectric degradation are inhibited, but large capacity vacuum pumps are required which increases cost and footprint
Solution Approach 1:
The patent applies local quality by providing protective gas flow only at the substrate location during transfer, rather than flooding the entire chamber. The gas delivery tube positions gas directly at the substrate, creating a localized protective atmosphere that prevents oxidation without requiring system-wide high gas flows, thus avoiding the need for large capacity vacuum pumps
Solution Approach 2:
The patent uses an intermediary approach by introducing a protective gas (nitrogen or inert gas) as a mediator between the substrate and the oxidizing environment in the vacuum chamber. This intermediary gas layer prevents direct contact between oxygen/water vapor and the substrate surface, protecting film layers without requiring extreme vacuum conditions or high-capacity pumping
2Stability of the object's composition
If constant pressure is maintained in vacuum transfer chamber, then transfer stability is ensured, but high gas flows are required which increases cost
Solution Approach 1:
The patent maintains chamber pressure stability through localized gas delivery at the substrate position rather than uniform gas distribution. The gas delivery tube targets gas flow precisely where needed (at the substrate), allowing pressure control with minimal gas consumption, thus reducing the quantity of gas required while maintaining stable transfer conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution creates a controlled environment that inhibits oxide formation and dielectric degradation, reduces particle deposition, and improves throughput by maintaining a protective gas blanket over the substrate during transport, reducing the need for high-capacity vacuum pumps and minimizing contamination.
Implementation Method 1
A gas outlet on the housing directs gas onto an exposed surface of the substrate during transport
Data Source
AI summary
A substrate handling robot includes an arm section and a wrist portion connected to the arm section. An end effector is connected to the wrist portion and is configured to support a substrate. A housing is arranged adjacent to the end effector and includes a gas outlet that directs gas onto an exposed surface of the substrate during transport.