Substrate Transfer Handoff Using Synchronized Lift Motion
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Solution Overview
Problem
Conventional substrate delivery methods in semiconductor processing are inefficient, requiring longer times due to the sequential raising and lowering of transfer mechanisms, which can lead to increased vibration and power consumption, and larger processing apparatus openings.
Innovation Solution
A method and system for high-speed substrate delivery between a pick of a substrate transfer device and elevating members by simultaneously lowering the pick and raising the elevating members, or vice versa, to reduce the elevating distance and minimize vibration, while maintaining efficient substrate handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sequential raising and lowering of transfer mechanisms is used, then substrate delivery can be completed, but delivery time increases and productivity decreases
Solution Approach 1:
The patent combines the raising motion of the elevating member and the lowering motion of the holder into a single simultaneous operation. Both movements occur at the same time during substrate delivery, merging two sequential actions into one concurrent action, thereby reducing total delivery time and improving productivity.
Solution Approach 2:
The elevating member is raised in advance before the holder reaches the delivery position. This preliminary raising action ensures that when the holder arrives, the elevating member is already in position to receive the substrate, eliminating waiting time and enabling immediate transfer.
2Adaptability or versatility
If larger elevating distance is used, then substrate transfer range is improved, but vibration increases and manufacturing precision deteriorates
Solution Approach 1:
The system dynamically adjusts the elevating distance based on the specific delivery requirements. The elevating member can vary its movement range to match the minimum necessary distance for each substrate transfer, avoiding excessive movement that would cause vibration and maintain high placement precision while still achieving adequate transfer range.
3Device complexity
If sequential transfer mechanism operation is used, then system complexity is reduced, but power consumption increases
Solution Approach 1:
The patent merges the operation of the holder and elevating member into a coordinated simultaneous motion. By controlling both mechanisms to move at the same time, the system reduces the total duration of power consumption and eliminates the need for one mechanism to remain powered while the other operates, thereby reducing overall energy usage.
Data Source
AI summary
A method of delivering a substrate includes moving a holder configured to hold the substrate in a substrate transfer device above a region where an elevating member configured to be capable of being raised/lowered is arranged; and delivering the substrate from the holder to the elevating member by simultaneously performing lowering of the holder and raising of the elevating member, or delivering the substrate from the elevating member to the holder by simultaneously performing lowering of the elevating member that supports the substrate and raising of the holder.