Substrate Heat Pipe With Via Opening For Thermal And Electrical Routing
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Solution Overview
Problem
The integration of a heat pipe into a substrate to enhance thermal conductivity compromises electrical conductivity due to space occupation, necessitating a new substrate structure that balances thermal and electrical performance.
Innovation Solution
A substrate structure incorporating a heat pipe with an opening, a conductive layer, and an insulation layer, where the conductive layer has a via structure passing through the opening, allowing for efficient heat dissipation while maintaining electrical connectivity through a redistribution layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat pipe is embedded in a substrate to enhance thermal conductivity, then heat dissipation capability is improved, but electrical conductivity is compromised due to space occupation
Solution Approach 1:
The substrate is segmented into multiple regions: a first region containing the heat pipe for thermal management, and a second region containing conductive traces for electrical connectivity. The opening in the heat pipe allows conductive traces to pass through, effectively dividing the substrate functionality into distinct zones that can operate independently without interfering with each other.
Solution Approach 2:
The conductive traces are routed through the opening in the heat pipe, transitioning from a two-dimensional plane to a three-dimensional path. This vertical routing through the heat pipe opening allows electrical traces to bypass the thermal conduction path, maintaining electrical conductivity while preserving the heat pipe's thermal management function.
2Temperature
If a heat pipe occupies substrate space for thermal management, then thermal conductivity is enhanced, but the space available for conductive traces is reduced
Solution Approach 1:
The conductive traces are nested within the three-dimensional structure by passing through the opening of the heat pipe. This nesting approach allows the traces to occupy the vertical space within the heat pipe opening rather than requiring additional lateral space on the substrate surface, effectively utilizing the heat pipe's internal volume for electrical routing.
Solution Approach 2:
The conductive traces utilize the vertical dimension by passing through the heat pipe opening, converting a lateral space constraint into a vertical routing solution. This dimensional transition allows the substrate to maintain both thermal management and electrical connectivity functions without compromising the area available for either purpose.
3Reliability
If conductive traces are routed through the heat pipe opening, then electrical connectivity is maintained, but manufacturing complexity increases
Solution Approach 1:
The opening in the heat pipe is pre-formed before the conductive traces are deposited or routed. This preliminary preparation of the heat pipe structure with the opening already in place simplifies the subsequent trace routing process, as the path for the traces is already defined and does not require complex post-processing or modification of the heat pipe structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation capabilities while preserving sufficient electrical pathways, reducing the maximum temperature of semiconductor devices and maintaining a compact size compared to traditional designs.
Implementation Method 1
embed a heat pipe in a substrate
Implementation Method 2
The first conductive layer is disposed on the upper surface and includes a via structure passing through the opening
Data Source
AI summary
A substrate structure, a method for manufacturing the same and a semiconductor device structure including the same are provided. The substrate structure includes a heat pipe, a first conductive layer and an insulation layer. The heat pipe has an upper surface and a lower surface. The heat pipe includes an opening extending from the upper surface to the lower surface. The first conductive layer is disposed on the upper surface and includes a via structure passing through the opening. The insulation layer is disposed between the heat pipe and the conductive layer.