Multilayer Substrate Heat Sink Integration for RF Frontend Modules
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Solution Overview
Problem
Existing electrical components for radio devices face challenges in achieving a small space requirement while maintaining high power compatibility, particularly in efficiently dissipating heat and integrating multiple functional units within a compact substrate.
Innovation Solution
An electrical component with a multilayer substrate that incorporates a heat sink as a circuit component, utilizing plated through-holes for thermal conductivity and electromagnetic shielding, and integrating various functional units such as antenna switches, amplifiers, filters, and transformers to form a compact, highly-integrated frontend module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If multiple functional units are integrated into a compact substrate, then space requirement is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent merges the heat sink with the substrate structure itself, making the substrate serve dual functions as both the circuit carrier and the thermal management component. The substrate includes a heat sink region with thermal vias that conduct heat away from active components, eliminating the need for separate heat dissipation structures and enabling compact integration while maintaining effective heat removal.
Solution Approach 2:
The patent utilizes the vertical dimension by implementing thermal vias that extend through the substrate thickness to conduct heat from the front surface to the rear surface where heat dissipation structures are located. This three-dimensional thermal management approach allows efficient heat removal within the compact substrate volume without increasing the planar footprint.
2Area of moving object
If multiple functional units are integrated into a compact substrate, then space requirement is reduced, but power compatibility becomes more challenging
Solution Approach 1:
The patent combines multiple functional units (antenna switches, amplifiers, filters, baluns) and their supporting structures (signal paths, ground connections, power supply lines) into a single integrated substrate assembly. This consolidation maintains full power handling capability while reducing the overall space requirement by eliminating the need for separate mounting of discrete components.
Solution Approach 2:
The substrate is designed as a multi-functional platform that simultaneously provides mechanical support, electrical connections, thermal management, and signal routing for various power-compatible components. The integrated structure accommodates different functional units with varying power requirements within a unified design framework.
3Temperature
If heat sink is led through the substrate, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The heat sink structure is merged with the substrate manufacturing process itself. Thermal vias are formed as part of the standard substrate fabrication sequence, and heat dissipation structures are created using the same lamination and metallization techniques used for the circuit traces, thereby achieving efficient heat removal without significantly increasing manufacturing complexity.
Solution Approach 2:
The patent optimizes thermal via parameters (diameter, spacing, depth, plating thickness) and heat sink structure dimensions during the design phase to achieve effective heat dissipation within the constraints of standard manufacturing capabilities. These parameter optimizations balance thermal performance with manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation and compact integration of multiple functional units, achieving significant space savings of up to 90% compared to conventional solutions, suitable for mobile radio terminals and handheld devices.
Implementation Method 1
a substrate (1) with an integrated circuit (2) and heat sinks (103-109) arranged in the substrate... plated through-holes for thermal conductivity
Implementation Method 2
utilizing plated through-holes for thermal conductivity and electromagnetic shielding
Data Source
AI summary
An electrical component that includes a substrate that includes at least one electrical circuit is described herein. The electrical component also includes a heat sink in an aperture through the substrate.