Multilayer Substrate Heat Transfer Member Bonding
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Solution Overview
Problem
Conventional multilayer substrates, such as wireless communication modules, face issues with the heatsink easily detaching from the body, which affects heat transfer efficiency.
Innovation Solution
A multilayer substrate design featuring a base with insulating layers made of thermoplastic resin, a heat transfer member with higher thermal conductivity, and joining members made of materials like tin, which are thermally bonded to prevent detachment and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a heatsink is used to transfer heat from the passive element, then heat transfer efficiency is improved, but the heatsink is easily dropped or detached from the body
Solution Approach 1:
The patent merges the heatsink (heat transfer member) with the insulating layers by extending the heat transfer member through the insulating layers and bonding them together. This integration ensures that the heatsink becomes structurally part of the substrate body, preventing detachment while maintaining heat transfer functionality.
Solution Approach 2:
The patent applies a joining member (solder or adhesive) in advance to the surface in contact between the heat transfer member and the insulating layers before final assembly. This preliminary bonding action ensures secure attachment before the device undergoes thermal cycling or mechanical stress that could cause detachment.
2Loss of energy
If the heat transfer member is made of material with high thermal conductivity, then heat dissipation is improved, but the material selection and joining process become more complex
Solution Approach 1:
The patent introduces a joining member (solder or adhesive) as an intermediary between the heat transfer member and the insulating layers. This intermediary facilitates the bonding of dissimilar materials (metal heatsink to polymer insulating layers) while maintaining thermal conductivity, thus simplifying the overall joining process despite material differences.
Solution Approach 2:
The patent employs composite material structures where the heat transfer member (metal with high thermal conductivity) is bonded to insulating layers (thermoplastic resin) through a joining member. This composite approach allows optimization of each component for its specific function while achieving overall system performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents the heat transfer member from detaching, ensuring reliable heat transfer and maintaining the structural integrity of the multilayer substrate, thereby improving thermal management and device performance.
Implementation Method 1
a first joining member disposed between the heat transfer member and the first metal film, the first joining member being made of a material with a third coefficient of thermal conductivity which is higher than the first coefficient of thermal conductivity of the material of the plurality of insulating layers
Implementation Method 2
a base including a plurality of insulating layers stacked on one another in a layer stacking direction
Data Source
AI summary
A multilayer substrate includes a base including insulating layers stacked on one another, a first principal surface, and a second principal surface, a heat transfer member extending through a first insulating layer nearest to the first principal surface, a second coefficient of thermal conductivity of a material of the heat transfer member is higher than a first coefficient of thermal conductivity of a material of the insulating layers, a first metal film adhered to the first principal surface, the first metal film overlapping the heat transfer member when viewed from the layer stacking direction, and a first joining member disposed between the heat transfer member and the first metal film and being made of a material with a coefficient of thermal conductivity which is higher than the first coefficient of thermal conductivity of the material of the insulating layers.