Substrate Support Heat Transfer Structures for Gas-Free Thermal Contact
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Solution Overview
Problem
Conventional methods for transferring heat between a substrate and a substrate support in semiconductor manufacturing are inefficient due to the use of gases as thermal conductors, which are consumable and increase manufacturing costs.
Innovation Solution
The implementation of heat transfer structures with high thermal conductivity extending from a substrate support surface, which deform to conform to the substrate's shape, enhancing direct thermal contact and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If heat is transferred from substrate support to substrate through gases, then heat transfer can be achieved, but thermal conductivity is poor and manufacturing costs increase due to consumable gases
Solution Approach 1:
The patent introduces heat transfer structures (pins, posts, or protrusions) as intermediary elements between the substrate support and substrate. These structures directly conduct heat from the support to the substrate, replacing the gas-mediated heat transfer pathway. The heat transfer structures serve as a solid thermal conduit, eliminating the need for consumable gases while improving thermal conductivity.
Solution Approach 2:
The patent replaces the gas-based thermal conduction system with a solid mechanical contact system. Instead of relying on gas molecules to transfer thermal energy, the invention uses physically extended heat transfer structures that make direct contact with the substrate, substituting a mechanical/solid conduction mechanism for the gaseous conduction mechanism.
2Temperature
If conventional gas-based heat transfer is used, then substrate heating can be achieved, but thermal conductivity is insufficient
Solution Approach 1:
The heat transfer structures act as intermediary thermal conduits with high thermal conductivity material properties. These structures bridge the thermal gap between the substrate support and substrate, providing an efficient heat transfer pathway that overcomes the poor thermal conductivity of gases while enabling precise substrate temperature control.
3Loss of energy
If heat transfer structures extend from substrate support surface, then direct thermal contact is improved, but device complexity increases
Solution Approach 1:
The patent divides the heat transfer function into discrete, segmented elements (multiple pins, posts, or protrusions distributed across the substrate support surface). Rather than requiring a complex continuous thermal interface, the segmentation approach uses multiple simple, identical elements that collectively provide efficient heat transfer while maintaining structural simplicity and ease of manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more efficient heat transfer between the substrate and support, reducing material consumption and costs while maintaining process control.
Implementation Method 1
The heat transfer structures are configured to transfer heat between the substrate and the substrate support
Implementation Method 2
A heating element is disposed within the substrate support
Data Source
AI summary
Embodiments of the disclosure include apparatus and methods for transferring heat between a substrate and a substrate support. The substrate support is disposed within a processing chamber. A heat exchanging element is disposed within the substrate support. A plurality of heat transfer structures extend from a surface of a substrate base of the substrate support. The heat transfer structures are configured to transfer heat between the substrate and the substrate support.