Substrate Heater Optical Guidance for Contamination Control

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Solution Overview

Problem

In substrate processing for semiconductors and liquid crystal panels, the miniaturization and higher integration of components lead to pattern collapse issues due to surface tension and contamination from mist or particles adhering to the lamp, which interrupts clean air supply and results in substrate contamination.

Innovation Solution

A substrate processing apparatus with a heater positioned outside the processing chamber and an optical member inside to guide light for uniform heating, preventing contamination and ensuring clean air flow by not locating the heater above the substrate, and using a volatile solvent with lower surface tension to aid in drying.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the lamp is located above the surface to be treated of the substrate, then the substrate can be heated for drying, but mist or particles of the treatment liquid adhere to the lamp and contaminate the substrate

Engineering Contradiction:
Improvedrying efficiencyVSAvoidsubstrate contamination
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The heater is extracted from the processing chamber and relocated to the outside environment. The optical member (lens or reflector) acts as an intermediary to transmit heat to the substrate without the heater being physically present above it, thereby eliminating contamination while maintaining heating function

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

An optical member (lens or reflector) is introduced as an intermediary between the heater and the substrate. This mediator transmits thermal energy to the substrate while preventing direct contact between the heater and treatment liquid, solving the contamination problem

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If the lamp is located above the surface to be treated of the substrate, then heating can be performed, but clean air flow is interrupted and particles cannot be removed from the surface

Engineering Contradiction:
Improveheating capabilityVSAvoidclean air supply
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The heater is extracted from the processing chamber to eliminate the physical obstruction to clean air flow. The optical member serves as a non-obstructive intermediary that maintains both heating function and air flow reliability

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The heating function is transferred from a vertical position (above substrate) to a lateral position (outside chamber), changing the spatial dimension of heat application. This allows clean air to flow vertically without interruption while heating remains effective through optical transmission

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If a volatile solvent with lower surface tension is used, then pattern collapse can be suppressed, but additional processing steps are required

Engineering Contradiction:
Improvepattern integrityVSAvoidprocessing steps
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The surface tension parameter of the liquid is changed by using a volatile solvent with lower surface tension instead of water. This parameter change prevents pattern collapse by reducing surface tension forces that cause the effect, though it requires additional processing steps for solvent removal

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration prevents contamination, ensures uniform drying, and maintains clean air flow, effectively reducing pattern collapse and substrate contamination, while allowing for efficient processing without overheating the processing chamber.

Implementation Method 1

an optical member arranged in the processing chamber so as not to be above the support part to guide the light emitted by the heater and having passed above the support part to the surface to be treated

Methodology Applied
Scientific EffectLight guidance: Reflection

Implementation Method 2

a heater arranged so as not to be above the support part and emits light for heating

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

the substrate is dried by replacing the rinsing liquid on the treated surface of the substrate with a volatile solvent

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 4

a volatile solvent (e.g., IPA: 2-propanol, isopropyl alcohol) with a surface tension smaller than that of the rinsing liquid

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Data Source

PatentUS10460961B2Substrate processing apparatus
Publication Date: 2019.10.29 SHIBAURA MECHATRONICS CORP
  • US10460961B2 patent drawing
  • US10460961B2 patent drawing
  • US10460961B2 patent drawing

AI summary

According to one embodiment, a substrate processing apparatus includes a processing chamber, a support part, a heater, and an optical member. In the processing chamber, air flows from the top to the bottom. The support part is located in the processing chamber to support a substrate having a surface to be treated. The heater is arranged so as not to be above the support part and emits light for heating. The optical member is arranged in the processing chamber so as not to be above the support part to guide the light emitted by the heater and having passed above the support part to the surface to be treated of the substrate supported by the support part.