Substrate Heater Temperature Control via Segmented Steps
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing technologies face limitations in achieving precise temperature control beyond the control limit of the heater, which affects the inter-plane uniformity of film thickness, particularly in semiconductor miniaturization where finer precision is required.
Innovation Solution
A temperature control method that involves setting a target temperature with a second digit smaller than the first digit of the heater's control limit, dividing the temperature change into a first temperature equal to or greater than the first digit and a second temperature less than the first digit, calculating a ratio for time segmentation based on the digit difference, and controlling the heater to achieve finer temperature resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the heater control limit is used as the temperature control resolution, then the device complexity is low, but the manufacturing precision of film thickness is insufficient
Solution Approach 1:
The patent segments the temperature control process into multiple discrete steps, where the total temperature change is divided into several smaller increments. Each increment is controlled within the heater's control limit, but the cumulative effect achieves finer temperature resolution. This segmentation allows the system to achieve high manufacturing precision without requiring a more complex heater control system.
Solution Approach 2:
The patent performs preliminary calculation of the temperature change amount and divides it into appropriate increments before executing the heating process. The control system pre-determines the number of steps and temperature increment for each step, ensuring that the final temperature achieves the desired precision while staying within the heater's control capabilities throughout the process.
2Measurement precision
If the temperature control resolution is increased beyond the heater control limit, then the manufacturing precision improves, but the device complexity increases
Solution Approach 1:
The patent implements periodic temperature adjustments through multiple heating steps rather than a single continuous adjustment. The temperature is raised in periodic increments, with each increment staying within the heater's control limit. This periodic action allows the system to achieve higher measurement precision for temperature control without requiring the heater itself to have higher resolution capabilities.
Solution Approach 2:
The patent dynamically adjusts the temperature control strategy by calculating the appropriate number of steps and increment size based on the total temperature change required. The control system adapts the heating parameters in real-time, dividing large temperature changes into more steps and smaller increments, thereby achieving high temperature resolution dynamically without hardware modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for temperature control with a resolution finer than the heater's control limit, significantly improving the inter-plane uniformity of film thickness and enhancing the yield of semiconductor processing without requiring hardware modifications.
Implementation Method 1
a heater that heats an inside of the processing container
Data Source
AI summary
A temperature control method includes providing a substrate processing apparatus including a processing container, and a heater that heats the processing container; setting an amount of temperature change with respect to a target temperature having a value up to a second digit smaller than a first digit indicating a control limit value of the heater; dividing the amount of temperature change into a first temperature equal to or greater than the first digit and a second temperature less than the first digit, and calculating a ratio of dividing a time segmented by a digit difference between the first digit and the second digit, into a first time corresponding to the second temperature and a second time other than the first time; and controlling the heater to raise or lower a temperature in times before and after dividing a processing time in a processing step at the ratio.