Substrate Heat Treatment Device Cooling Arm
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Solution Overview
Problem
Existing substrate heat treatment devices face reduced operation rates and throughput due to inefficiencies in cooling processes, such as prolonged heating times and time-consuming wafer transfer between heating and cooling plates, which hinder the photolithography process in semiconductor manufacturing.
Innovation Solution
A substrate heat treatment device is designed with a substrate transfer arm and a substrate holding unit that allows for concurrent heating and cooling operations, enabling efficient transfer and cooling of substrates between heating and cooling plates, thereby improving operational efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If one cooling plate corresponding to one heating plate is provided, then the structure is simple, but the operation rate and throughput are reduced due to idle cooling periods
Solution Approach 1:
The cooling function is segmented into two independent cooling plates instead of using one cooling plate. This allows parallel cooling operations where one cooling plate can cool a substrate while the other cooling plate is being transferred to or is ready for the next substrate, eliminating idle cooling periods and improving throughput
Solution Approach 2:
The system dynamically coordinates the operation cycles of two cooling plates with one heating plate. When one cooling plate finishes cooling a substrate, it transfers to the heating plate while the other cooling plate simultaneously begins cooling the next substrate, creating a dynamic workflow that eliminates idle time and maximizes productivity
2Reliability
If two transfer arms are used to transfer the wafer between heating plate and cooling plate, then the transfer is stable, but the operation time is extended and throughput is reduced
Solution Approach 1:
The transfer function is segmented between the substrate transfer arm and the cooling plate. The cooling plate itself becomes a mobile transfer device that can autonomously move between the heating plate and the substrate transfer arm, eliminating the need for a separate second transfer arm while maintaining stable transfer operations
Solution Approach 2:
The cooling plate is given multi-functionality: it not only cools substrates but also serves as a transfer device. The cooling plate can move independently to transfer substrates between the heating plate and the substrate transfer arm, combining cooling and transfer functions into a single component that improves throughput without sacrificing transfer stability
3Reliability
If the wafer is cooled on the cooling plate before being taken out of the heat treatment device, then the cooling is effective, but the total process time is increased
Solution Approach 1:
The cooling process begins in advance during the substrate's residence on the heating plate. When the substrate is transferred from the heating plate to the cooling plate, the cooling has already started, overlapping the cooling phase with the end of the heating phase and reducing the total process time while maintaining effective cooling
Solution Approach 2:
The cooling action continues seamlessly as the substrate moves from the heating plate to the cooling plate. The cooling process is not interrupted or delayed by transfer operations, maintaining continuous useful action that reduces total process time while ensuring the substrate is properly cooled before exiting the device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enhances operation efficiency by allowing simultaneous heating and cooling operations, reducing the time required for the heat treatment process and increasing the throughput of the heat treatment device.
Implementation Method 1
a heating plate that mounts thereon a substrate and performs a heat treatment on the substrate
Implementation Method 2
the wafer is heated to a preset temperature ranging from, e.g., about 100° C. to about 350° C.
Implementation Method 3
a substrate holding unit configured to cool a previously heat-treated substrate by the heating plate
Implementation Method 4
cool the heated wafer
Data Source
AI summary
A substrate heat treatment device includes: a heating plate that mounts a wafer and performs a heat treatment on the wafer; a substrate transfer arm that transfers the wafer to the heating plate and is movable from and toward the heating plate; a transfer arm moving device that moves the substrate transfer arm between a position above the heating plate and a standby position of the substrate transfer arm apart from the heating plate; a substrate transfer device that transfers the wafer to and from the substrate transfer arm located at the standby position. The substrate heat treatment device further includes a cooling arm serving as a substrate holding unit configured to cool a previously heat-treated wafer by the heating plate and transfer a next wafer to the heating plate while the previously heat-treated wafer is transferred to the substrate transfer device.