Substrate Processing Layout for Parallel Heating and Cooling Flow
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor device manufacturing, excess waiting time for substrates increases due to the end times of heating and cooling processes in substrate-processing apparatuses, leading to inefficiencies in processing throughput.
Innovation Solution
A substrate processing apparatus with a process chamber for heating, a boat for supporting substrates, a revolution part for rotating the boat, a delivery chamber with separate areas for waiting and cooling, and a controller that adjusts operations based on the difference between the end times of the heating and cooling processes to optimize substrate movement and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the substrate is cooled in the transfer chamber after the heating process, then the cooling process can be performed, but the excess waiting time of substrates increases due to the end time difference between heating and cooling processes
Solution Approach 1:
The patent introduces a vertical dimension by placing the cooling chamber below the process chamber, allowing substrates to be cooled in a different spatial dimension while maintaining continuous processing flow. This eliminates the need for horizontal transport and waiting time associated with sequential processing in the same chamber.
Solution Approach 2:
The cooling chamber is prepared in advance and operates simultaneously with the heating process. Substrates are cooled in parallel with the heating of other substrates, eliminating the sequential waiting time and enabling continuous throughput by having the cooling function ready beforehand.
2Productivity
If the substrate is moved between chambers for sequential heating and cooling processes, then the processing can be completed, but the processing throughput is reduced due to transfer and waiting time
Solution Approach 1:
The patent combines the heating and cooling functions into a single integrated apparatus with vertically stacked chambers. The boat support mechanism serves both chambers, and substrates are processed in parallel through simultaneous heating in the upper chamber and cooling in the lower chamber, eliminating the need for separate transfer mechanisms between distant chambers.
Solution Approach 2:
The processing apparatus is segmented into functionally independent but spatially integrated heating and cooling chambers. Each chamber operates autonomously with its own process control, allowing parallel processing while sharing common infrastructure such as the boat support and control system, thus reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces excess waiting time for substrates, improving processing throughput by allowing for simultaneous cooling and preparation for the next substrate processing steps, thus enhancing overall efficiency.
Implementation Method 1
a cooler capable of performing a cooling process to the substrate in the second area
Implementation Method 2
a revolution part including a plurality of boat supports configured to support the boat, and capable of revolving the boat supports
Implementation Method 3
a process chamber where a substrate-processing process including a heating process to a substrate is capable of being performed
Data Source
AI summary
A technique includes a process chamber where a substrate-processing process including a heating process to a substrate is capable of being performed, a boat configured to support the substrate, a revolution part including a plurality of boat supports configured to support the boat, and capable of revolving the boat supports, a delivery chamber including a first area arranged below the process chamber, a second area where the substrate after the heating process is capable of waiting, and a third area where the substrate is capable of being delivered to and from an adjacent transfer chamber, among areas above the revolution part, a cooler capable of performing a cooling process to the substrate in the second area, and a controller capable of controlling a revolution operation or a movement operation.