Substrate Heating Control for Deformation Uniformity
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Solution Overview
Problem
The challenge in semiconductor manufacturing is achieving uniform heating processing on substrates with non-uniform deformation, as the deformation leads to inconsistent temperature distribution across the wafer plane, affecting the in-plane uniformity of heating.
Innovation Solution
A substrate processing apparatus with multiple independently controlled heating regions along the circumferential direction, which adjusts its orientation based on detected substrate deformation to ensure even heat transfer, preventing regions of large deformation from being placed on boundaries between heating control regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is placed on the placing portion for heating processing, then the heating processing can be performed, but the in-plane uniformity of substrate temperature deteriorates due to non-uniform deformation
Solution Approach 1:
The placing portion is divided into multiple heating control regions along the circumferential direction, with each region independently controllable. This segmentation allows different temperature control for different regions, compensating for the non-uniform heat transfer caused by substrate deformation and improving in-plane temperature uniformity.
Solution Approach 2:
Each heating control region is independently controlled to provide localized temperature adjustment. By adjusting the temperature of specific regions where substrate deformation occurs, the system compensates for local heat transfer issues and maintains uniform temperature distribution across the substrate surface.
2Manufacturing precision
If the substrate with large deformation is placed on the boundary between heating control regions, then the heating processing can be performed, but the heat transfer to the substrate is insufficient and temperature uniformity deteriorates
Solution Approach 1:
The system measures substrate deformation before heating processing and pre-adjusts the temperature distribution of heating control regions based on the measured deformation. This preliminary action ensures that when the substrate is placed on the placing portion, the heat transfer is optimized from the start, preventing temperature non-uniformity before it occurs.
Solution Approach 2:
The system measures substrate deformation and uses this information to adjust the temperature distribution of heating control regions. This feedback mechanism allows the system to adapt to substrate deformation and optimize heat transfer, improving temperature uniformity while maintaining manageable control complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the uniformity of heating processing by ensuring that temperature control is effectively reflected across the substrate, improving in-plane temperature uniformity even for substrates with saddle-like deformations.
Implementation Method 1
a heating processing is performed on the substrate... provide heaters in each divided region so as to independently control each heater to generate heat
Data Source
AI summary
A substrate processing apparatus that places a substrate on a placing portion and performs a heating processing on the substrate includes a plurality of heating control regions that are set plurally along a circumferential direction of the placing portion to heat the substrate placed on the placing portion, and are independently controlled in temperature, and an adjusting unit that adjusts a relative direction of a circumferential direction of the substrate with respect to an arrangement of the circumferential direction of the plurality of heating control regions based on information on deformation of the substrate different in height from a plane orthogonal to a center axis of the substrate in the circumferential direction.