Semiconductor Substrate Heating via Insulating Plate Correlation
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Solution Overview
Problem
The challenge in semiconductor manufacturing is achieving uniform and efficient annealing of high-density substrates with high-aspect-ratio patterns, where existing methods struggle to maintain precise temperature control and prevent deformation during the annealing process.
Innovation Solution
A substrate processing apparatus that uses a heat insulating plate and a non-contact thermometer to measure temperature changes, allowing for correlation-based control of the heating device to achieve precise temperature control and prevent deformation by pulsing microwave energy and maintaining temperature within a predetermined range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electromagnetic wave heating is used to heat the substrate, then heating efficiency is improved, but temperature control precision deteriorates
Solution Approach 1:
The patent introduces a heat insulating plate as an intermediary between the electromagnetic wave heating device and the substrate. The plate absorbs and distributes the electromagnetic energy uniformly, then transfers heat to the substrate through controlled thermal conduction. This mediator approach allows efficient electromagnetic heating while achieving uniform temperature distribution and precise temperature control across the substrate surface.
Solution Approach 2:
The patent implements a feedback control system using a non-contact thermometer to continuously monitor the substrate temperature and adjust the electromagnetic wave heating power accordingly. The temperature measurement feedback enables real-time adjustment of heating intensity, maintaining precise temperature control during the annealing process while preserving the high heating efficiency of electromagnetic wave heating.
2Speed
If high-power electromagnetic waves are used for rapid heating, then heating speed is improved, but temperature uniformity deteriorates
Solution Approach 1:
The heat insulating plate serves as a thermal mediator that receives rapid electromagnetic heating and distributes the thermal energy uniformly across its surface through thermal conduction. This allows the system to achieve rapid overall heating while maintaining uniform temperature distribution, as the plate's thermal properties ensure even heat spread before transfer to the substrate.
Solution Approach 2:
The patent employs periodic pulsing of the electromagnetic wave heating rather than continuous high-power delivery. By applying heating in controlled pulses with appropriate intervals, the system achieves rapid cumulative heating while allowing thermal equilibrium to establish between pulses, thereby maintaining temperature uniformity across the substrate during the annealing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures accurate temperature control during substrate processing, preventing deformation and achieving uniform heating of high-density substrates with high-aspect-ratio patterns, thereby improving the quality and efficiency of semiconductor manufacturing.
Implementation Method 1
heating a heat insulating plate, which is held by a substrate holder configured to hold a substrate, to a processing temperature, at which the substrate is processed, by an electromagnetic wave supplied from a heating device
Implementation Method 2
measuring a temperature change of the heat insulating plate by a non-contact type thermometer
Data Source
AI summary
There is provided a technology includes: heating a heat insulating plate, which is held by a substrate holder configured to hold a substrate, to a processing temperature, at which the substrate is processed, by an electromagnetic wave supplied from a heating device, and measuring a temperature change of the heat insulating plate until the heat insulating plate reaches the processing temperature; heating the substrate, to the processing temperature and measuring a temperature change of the substrate until the substrate reaches the processing temperature; obtaining a correlation between the temperature change of the heat insulating plate and the temperature change of the substrate and heating the substrate by controlling the heating device based on the temperature of the heat insulating plate and the correlation.