Substrate Heating Apparatus Molybdenum-Tungsten Alloy Connecting Member
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Solution Overview
Problem
Substrate heating apparatuses face issues with temperature deviation and fine cracks due to thermal expansion and compressive stress during high-temperature and high-pressure processes, leading to reduced durability and service life.
Innovation Solution
A substrate heating apparatus is designed with a first heating element in the inner region, a second heating element in the outer region, and a third heating element that transmits power across the inner region, using a connecting member made of a molybdenum-tungsten alloy to minimize overheating and thermal stress, and featuring a heat treatment process including annealing and rapid cooling to enhance stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a conductor is used to transmit power to a heating element in the outer region across the inner region, then the heating element can be powered, but the conductor generates heat causing overheating in specific regions
Solution Approach 1:
The patent introduces an intermediate heating element that acts as a mediator between the power source and the outer heating element. This intermediate element distributes the power transmission path and dissipates heat along the transmission path, preventing localized overheating in the conductor region.
Solution Approach 2:
The patent changes the physical parameters of the heating element structure by dividing it into multiple segments (inner and outer heating elements) with different spatial distributions. This parameter change allows power to be transmitted and converted to heat in a distributed manner rather than concentrated in a single conductor path.
2Temperature
If the substrate heating apparatus is divided into inner region and outer region with separate heating elements, then temperature deviation between regions is reduced, but the structure becomes more complex
Solution Approach 1:
The patent segments the heating apparatus into distinct functional regions with dedicated heating elements - an inner heating element for the central region and an outer heating element for the peripheral region. This segmentation allows independent temperature control in each zone, achieving uniform substrate heating while managing structural complexity through modular design.
3Ease of manufacture
If high pressure and high temperature are applied during sintering to manufacture the ceramic body, then the ceramic body is formed, but thermal stress and compressive stress cause fine cracks in the body
Solution Approach 1:
The patent applies preliminary protective actions during the sintering process by carefully controlling the heating rate, pressure application timing, and atmospheric conditions. These preliminary measures prevent thermal shock and stress concentration that would otherwise cause cracks, ensuring the ceramic body forms without defects while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses overheating, reduces temperature deviation, and prevents fine cracks, thereby improving thermal and structural stability and extending the service life of the substrate heating apparatus.
Implementation Method 1
a connecting member that electrically connects the second heating element and the third heating element
Implementation Method 2
capable of effectively suppressing the occurrence of fine cracks due to thermal expansion and compressive stress
Implementation Method 3
featuring a heat treatment process including annealing and rapid cooling
Implementation Method 4
compressive stress caused by high temperature and high pressure applied to the connecting member
Implementation Method 5
a first heating element located in an inner region of the substrate heating apparatus, a second heating element located in an outer region, a third heating element configured to transmit power to the second heating element
Data Source
AI summary
The present disclosure discloses a substrate heating apparatus for heating a substrate, wherein the substrate heating apparatus includes: a body including a substrate seating portion on which the substrate is seated, to support the substrate; a first heating element located in an inner region of the body; a second heating element located in an outer region surrounding the inner region; a third heating element configured to transmit current to the second heating element across the inner region of the body; and a connecting member electrically interconnecting the second heating element and the third heating element, wherein the connecting member is made of a molybdenum-tungsten alloy containing molybdenum and tungsten.