Substrate Heating Modules Integrated Heat Control
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Solution Overview
Problem
Current substrate processing technologies face challenges in achieving both in-plane and inter-plane temperature uniformity during the heating process, which affects the line width uniformity of resist patterns in semiconductor manufacturing, particularly due to variations in temperature history across and between substrates.
Innovation Solution
A substrate processing apparatus with multiple heating modules, each having independently controlled heaters, uses a control unit to ensure that the integrated heat quantities across and between modules are identical, achieved through a method involving temperature sensors, offset values, and precise control of electric power to maintain stable temperature profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple heating modules are used to process multiple wafers simultaneously, then productivity is improved, but inter-plane temperature uniformity deteriorates
Solution Approach 1:
The patent applies parameter changes by calculating integrated heat quantities (Q = ∫P dt) for each heating module and adjusting the operation time or power output of individual modules. This allows different heating modules to deliver identical total heat quantities to different wafers, achieving inter-plane temperature uniformity while maintaining high productivity through parallel processing.
2Manufacturing precision
If conventional temperature control methods are used, then device complexity is reduced, but manufacturing precision deteriorates
Solution Approach 1:
The patent replaces complex real-time mechanical temperature control with a calculated approach using integrated heat quantities. Instead of continuously adjusting power to maintain constant temperature across multiple modules, the system calculates required heat quantities and controls each module independently, achieving precision (±0.1°C uniformity) with simpler control logic.
3Manufacturing precision
If temperature control is optimized for in-plane uniformity, then manufacturing precision is improved, but inter-plane uniformity deteriorates
Solution Approach 1:
The patent applies local quality by independently controlling each heating module's integrated heat quantity based on its specific characteristics. Each module receives customized control parameters (power, time) to compensate for individual variations, ensuring that every wafer regardless of which module processes it receives identical total heat treatment, achieving both in-plane and inter-plane uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures excellent in-plane and inter-plane uniformity of substrates, enhancing the consistency of resist pattern line widths by maintaining identical heat profiles across and between substrates, thereby improving the overall processing quality.
Implementation Method 1
a table on which a substrate is placed to be heated, the table having a plurality of heaters each assigned to heat respective ones of the heated zones
Implementation Method 2
a control unit that outputs control signals that controls the heaters such that integrated quantities of heat of the respective heated zones given by the corresponding heaters from a first time point to a second time point are substantially identical to each other
Data Source
AI summary
A substrate processing apparatus includes plural heating modules each including a table on which a substrate is placed to be heated, the substrate having plural heated zones. The table has plural heaters each assigned to heat respective ones of the heated zones. Heat generation of the heaters is controlled independently. A control unit controls the heaters such that integrated quantities of heat of the respective heated zones given by the corresponding heaters from first to second time point are substantially identical to each other in each of the heating modules, and are substantially identical to each other among the heating modules. The first time point is set when a temperature transition profile of the substrate is rising toward a process temperature after placing the substrate on the table under a condition where heat generation of the heaters is stable. The second time point is set after the temperature transition profile reaches the process temperature.