Substrate processing apparatus and substrate processing method
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Solution Overview
Problem
Existing substrate processing apparatuses struggle to accurately measure substrate temperatures in the low-temperature region (approximately 600° C. or less) due to light transmittance characteristics of substrates, leading to temperature measurement errors and potential substrate damage.
Innovation Solution
The use of a substrate processing apparatus equipped with semiconductor laser modules having a main emission wavelength less than the measurement wavelength of the pyrometer, allowing for accurate temperature measurement and control in low-temperature regions. This configuration includes a chamber, substrate support, heater with semiconductor laser modules, and a pyrometer to detect incident light from the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a pyrometer with measurement wavelength band of approximately 0.9 μm to approximately 1.0 μm is used to measure substrate temperature, then temperature measurement is possible in the high-temperature region (above 600°C), but temperature measurement error occurs in the low-temperature region (600°C or less) due to light transmittance characteristics
Solution Approach 1:
The patent changes the measurement wavelength parameter of the pyrometer to resolve the contradiction. Specifically, it uses a first pyrometer with a measurement wavelength band of 0.9-1.0 μm for high-temperature measurement (above 600°C) and a second pyrometer with a measurement wavelength band of 1.5-1.6 μm for low-temperature measurement (600°C or less). This parameter change allows accurate temperature measurement across the entire temperature range by selecting the appropriate wavelength band based on substrate transmittance characteristics at different temperatures.
2Power
If halogen lamps with radiation wavelength of approximately 0.4 μm to approximately 6.0 μm are used for heating, then efficient heating is achieved, but light transmission through the substrate at low temperatures causes measurement errors
Solution Approach 1:
The patent introduces a wavelength-selective measurement system as an intermediary between the halogen lamp heating system and the temperature measurement. By using a second pyrometer with a measurement wavelength band of 1.5-1.6 μm for low-temperature measurement, the system selectively measures radiation at a wavelength where the substrate does not transmit light, thereby eliminating the interference from transmitted halogen lamp radiation while maintaining heating efficiency.
3Productivity
If temperature measurement is performed in the low-temperature region, then thermal management efficiency is improved, but substrate damage may occur due to inaccurate measurement and arbitrary heating control
Solution Approach 1:
The patent implements a feedback control system that uses accurate temperature measurement to control the halogen lamp output. By using a second pyrometer with a measurement wavelength band of 1.5-1.6 μm to accurately measure substrate temperature in the low-temperature region (600°C or less), the system provides accurate feedback to the heating controller, enabling precise control of the halogen lamp output and preventing substrate damage from arbitrary or excessive heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise temperature measurement and control of substrates in the low-temperature region, ensuring temperature uniformity and preventing substrate damage, while also reducing power consumption and improving light characteristics through the use of vertical cavity surface emitting lasers.
Implementation Method 1
The pyrometer concentrates radiant energy emitted from the substrate to measure the temperature of the substrate in the non-contact manner, based on a blackbody radiation temperature relationship
Implementation Method 2
a heater provided with a plurality of semiconductor laser modules configured to irradiate light toward a first face of the substrate
Data Source
AI summary
The present inventive concept relates to a substrate processing apparatus and a substrate processing method, which can accurately measure temperature in even a low-temperature region, thus making it possible to efficiently manage heat. The substrate processing apparatus comprises: a chamber for providing a processing space in which a substrate is processed; a substrate support provided in the processing space of the chamber in order to support the substrate; a heater provided with a plurality of semiconductor laser modules that emit light toward a first surface of the substrate; and a pyrometer which is provided on the side of a second surface of the substrate facing the first surface and detects light emitted from the substrate to measure the temperature of the substrate. The main light-emitting wavelength of the plurality of semiconductor laser modules may be shorter than the measurement wavelength of the pyrometer.