Substrate Heating Element with Reflection Plate

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Solution Overview

Problem

Existing substrate treating apparatuses face challenges in uniformly heating substrates during high-temperature processes, such as etching with chemical solutions like sulfuric acid or phosphoric acid, which affects the etch rate and process efficiency.

Innovation Solution

A substrate treating apparatus is designed with a heating unit that includes concentrically arranged lamps and a reflection element with multiple metallic plates to efficiently distribute and reflect heat uniformly across the substrate, ensuring consistent heating during processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a heating element is placed in a substrate treating apparatus to heat the substrate, then the etch rate is improved, but the heating uniformity across the substrate deteriorates

Engineering Contradiction:
Improveetch rateVSAvoidheating uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The heating system is segmented into multiple heating elements (first heating element and second heating element) positioned at different locations. Each heating element independently heats a specific region of the substrate, allowing for distributed and uniform heat distribution across the entire substrate surface while maintaining high temperature for improved etch rate

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are provided with different heating characteristics through locally positioned heating elements. The first heating element targets a first region while the second heating element targets a second region, enabling localized heat control that ensures uniform heating across the entire substrate while maintaining the high temperatures needed for efficient etching

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus achieves uniform heating of substrates, enhancing the etch rate and overall process efficiency by effectively transmitting heat to the substrate surface, thereby improving the treatment outcomes.

Implementation Method 1

a heating unit placed in the substrate support unit to heat the substrate, the heating unit may include a heating element

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

a reflection element reflecting a heat from the heating element upward

Methodology Applied
Scientific EffectThermal radiation reflection: Reflection

Data Source

PatentUS10490427B2Apparatus for treating substrate
Publication Date: 2019.11.26 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US10490427B2 patent drawing
  • US10490427B2 patent drawing
  • US10490427B2 patent drawing

AI summary

A substrate treating apparatus is provided which includes a treating container of which a top end is opened, a substrate support unit placed in a treating container to support a substrate, a treatment solution supply unit supplying a treatment solution to a substrate put on the support unit, and a heating unit placed in the substrate support unit to heat the substrate. The heating unit includes a heating element and a reflection element reflecting a heat from the heating element upward.