Substrate Heating Surface Overlap for Uniform Thermal Processing
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Solution Overview
Problem
Existing substrate processing apparatuses experience uneven heating due to a heater with a smaller heating surface than the substrate, leading to in-plane non-uniformity in substrate processing.
Innovation Solution
A substrate processing apparatus with a heating surface that overlaps the entire substrate, allowing for uniform heating by positioning the substrate to face the heating surface from below and using a transferring unit to ensure the substrate is heated efficiently and uniformly, along with a retractable substrate holding unit to prevent interference and enhance heating uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heater is arranged at an inner side of the rotating ring with a heating surface smaller than the substrate, then the heater can be positioned within the substrate processing chamber, but the outer peripheral region of the substrate is more difficult to heat resulting in uneven heating and in-plane non-uniformity
Solution Approach 1:
The heater is repositioned from an inner arrangement to an outer arrangement where the heating surface extends beyond the substrate periphery. This dimensional change in heater placement allows the heating surface to overlap with the outermost periphery of the substrate in top view, ensuring uniform heat distribution across the entire substrate including the outer peripheral region.
2Temperature
If the heating surface overlaps with the outermost periphery of the substrate in top view, then the entirety of the substrate can be heated uniformly, but the device complexity increases due to the need for a transferring unit and retractable substrate holding unit
Solution Approach 1:
The substrate holding unit is designed to be retractable, allowing it to move between a holding position (where it clamps the substrate for processing) and a retracted position (where it does not interfere with heating). This dynamic adjustment enables the system to achieve uniform heating by the outer-arranged heater while maintaining substrate processing capabilities, thus managing device complexity through functional adaptability.
Solution Approach 2:
A transferring unit is introduced as an intermediary mechanism to transfer the substrate between the substrate holding unit and the heating unit. This intermediary component enables the coordinated operation of the retractable holding unit and the outer-arranged heater, facilitating uniform heating while maintaining the overall system functionality despite increased structural complexity.
3Reliability
If the substrate holding unit is fixed in position, then the substrate can be securely held for processing, but it interferes with the heating process when the heater is arranged to overlap with the substrate periphery
Solution Approach 1:
The substrate holding unit is designed with retractability, enabling it to switch between a forward position for secure substrate holding during processing and a retracted position that clears the heating path. This dynamic capability allows the system to maintain both substrate holding reliability and heating accessibility by adjusting the holding unit's position according to the operational phase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved in-plane uniformity in substrate processing by ensuring the entire substrate is uniformly heated, both by processing fluids and heat, thereby enhancing processing efficiency and consistency.
Implementation Method 1
the substrate can be heated efficiently by contacting the lower surface of the substrate with the heating surface of the substrate heating unit
Data Source
AI summary
A substrate processing apparatus includes a substrate holding unit which holds and rotates a substrate in a horizontal orientation, a substrate heating unit which has a heating surface which faces the substrate, held by the substrate holding unit, from below and overlaps with an outermost periphery of the substrate in top view, and heats the substrate in a state of contacting a lower surface of the substrate, a transferring unit which transfers the substrate between the substrate holding unit and the substrate heating unit, and a processing fluid supplying unit which supplies a processing fluid toward the substrate held by the substrate holding unit.