Substrate Liquid Heating via Vapor Discharge

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Solution Overview

Problem

Existing substrate liquid processing apparatuses face challenges in efficiently heating plating liquids on substrates, leading to suboptimal plating processing times and potential thermal deterioration of the plating liquids.

Innovation Solution

The apparatus incorporates a heating element comprising a cover body with a heater, a liquid flow path for pure water, and vapor discharge openings. Pure water is vaporized by the heater and ejected through the openings to heat the plating liquid on the substrate, utilizing latent heat and temperature differences for efficient heating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a heater is used to heat the plating liquid on the substrate, then the plating processing can be accelerated, but thermal deterioration of the plating liquid may occur

Engineering Contradiction:

Improveplating processing speedVSAvoidthermal deterioration of plating liquid

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a liquid intermediary substance that is supplied between the heater and the plating liquid. This intermediary liquid absorbs heat from the heater and transfers it to the plating liquid through controlled interaction, preventing direct thermal contact between the heater and plating liquid, thereby accelerating plating processing while avoiding thermal deterioration of the plating liquid composition

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent utilizes phase transition of the intermediary liquid (heating, vaporization, and condensation) as a heat transfer mechanism. The intermediary liquid is heated by the heater, vaporizes to contact the plating liquid for heat transfer, then condenses and cycles again. This phase transition process enables efficient heat transfer to accelerate plating while preventing direct thermal exposure of the plating liquid to high temperatures that would cause deterioration

Inventive Principle:

Principle #36Phase transitions

2Productivity

If the plating liquid is heated to accelerate processing, then productivity improves, but processing time may increase due to heating requirements

Engineering Contradiction:

Improveplating processing efficiencyVSAvoidheating time

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The patent establishes a continuous circulation system where the intermediary liquid continuously cycles between the heater, vaporization zone, plating liquid interaction zone, and condensation zone. This continuous phase transition and heat transfer process eliminates idle heating time, maintains optimal plating liquid temperature consistently, and accelerates plating processing without requiring extended heating periods

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The patent replaces conventional direct thermal heating mechanisms with a phase transition-based heat transfer system. Instead of directly heating the plating liquid through thermal conduction or radiation, the system uses the intermediary liquid's phase changes (evaporation and condensation) to transfer heat, which occurs more rapidly and efficiently, reducing the time required to reach optimal plating temperatures

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables rapid and efficient heating of plating liquids, reducing processing times while minimizing thermal deterioration, and allows for localized control of heating to ensure uniform plating across the substrate.

Implementation Method 1

a liquid flow path through which pure water flows and a vapor discharge opening which is connected to the liquid flow path and through which water vapor produced as the pure water is vaporized by heat from the heater is ejected

Methodology Applied

Scientific EffectVaporization: Evaporation

Implementation Method 2

heating the plating liquid on the substrate with the water vapor

Methodology Applied

Scientific EffectLatent heat transfer: Latent Heat

Implementation Method 3

heating the plating liquid on the substrate with the water vapor

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12209314B2Substrate liquid processing apparatus and substrate liquid processing method

Publication Date: 2025.01.28 TOKYO ELECTRON LTD

AI summary

A technique enabling to heat a plating liquid rapidly while suppressing thermal deterioration of the plating liquid is provided. A substrate liquid processing apparatus includes a substrate holder configured to hold a substrate; a plating liquid supply configured to supply the plating liquid on a processing surface of the substrate; and a heating element, configured to heat at least one of the plating liquid on the processing surface or the substrate, including a heater, a liquid flow path through which pure water flows, and a vapor discharge opening which is connected to the liquid flow path and through which water vapor produced as the pure water is vaporized by heat from the heater is ejected.