Substrate Heating During Volatile Liquid Drying
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Solution Overview
Problem
Conventional substrate processing methods using volatile processing liquids lead to cooling of the substrate during drying, resulting in condensation and the attachment of minute particles due to evaporation, increasing operating costs with the need for a low humidity environment.
Innovation Solution
A substrate processing method where the substrate is heated before and during the application of a volatile processing liquid, ensuring the surface temperature remains above the dew point to prevent condensation, using a high-temperature rinse liquid for heating and a volatile processing liquid for drying.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a volatile processing liquid is used for drying the substrate, then drying speed is improved, but substrate surface temperature decreases causing condensation and particle attachment
Solution Approach 1:
The patent applies preliminary anti-action by heating the substrate before applying the volatile processing liquid to counteract the cooling effect that would cause condensation. The heating unit raises the substrate temperature above the dew point in advance, preventing condensation and particle attachment before they can occur during the drying process.
Solution Approach 2:
The patent changes the temperature parameter of the substrate by introducing a heating unit that maintains the substrate surface temperature above the dew point. This parameter change prevents the harmful condensation effect while preserving the fast drying benefit of the volatile processing liquid.
2Productivity
If a volatile processing liquid is ejected onto the substrate for rapid drying, then drying efficiency is improved, but the need for low humidity environment increases operating costs
Solution Approach 1:
The patent converts the harmful cooling effect of volatile liquid evaporation into a beneficial heating effect by introducing a heating unit. This allows the system to maintain substrate temperature above the dew point, eliminating condensation issues and the need for costly low humidity environment control while preserving rapid drying efficiency.
3Object-affected harmful factors
If the substrate is heated before applying volatile processing liquid, then condensation is prevented, but energy consumption increases
Solution Approach 1:
The patent applies partial action by heating the substrate only to the extent necessary to maintain the surface temperature above the dew point, not to excessive temperatures. This prevents condensation while minimizing energy consumption by applying just the required amount of heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents condensation and attachment of minute particles on the substrate surface, reducing operating costs by eliminating the need for a low humidity environment and ensuring efficient drying.
Implementation Method 1
heating the substrate on which a liquid film of the processing liquid is formed; stopping the supply of the volatile processing liquid to the substrate; and drying the substrate by removing the volatile processing liquid. In particular, the heating of the substrate starts before the supplying of the volatile processing liquid, and the substrate is heated so that the surface temperature of the substrate is higher than a dew point
Implementation Method 2
a volatile chemical liquid such as isopropyl alcohol (IPA) is used as a drying liquid, and a volatile processing liquid is ejected to the surface of the substrate to substitute a rinse liquid or the like, thereby rapidly drying the substrate
Data Source
AI summary
An apparatus comprising: a processing liquid supply unit; a volatile processing liquid supply unit; a substrate heating unit; and a controller to control the volatile processing liquid supply unit and the substrate heating unit, wherein the controller executes a process of supplying the processing liquid to the substrate, a process of heating the substrate on which a liquid film of the processing liquid is formed, a process of supplying a volatile processing liquid, a process of stopping the supply of the volatile processing liquid, and a process of drying the substrate by removing the volatile processing liquid, and wherein the process of heating the substrate starts before the process of supplying the volatile processing liquid, and the substrate heating unit heats the substrate so that the surface temperature of the substrate is higher than a dew point before the surface of the substrate is exposed from the volatile processing liquid.


