Substrate Heating Wire Segmentation for Uniform Temperature
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Solution Overview
Problem
Existing substrate heating systems in semiconductor fabrication apparatuses face challenges in achieving uniform heating due to the increased resistance and length of parallel-connected heating wires, which are not suitable for small areas and may result in inadequate heat distribution, especially as they extend towards the edge of the support plate.
Innovation Solution
The substrate supporting unit employs a combination of first and second heating wires connected in series and parallel configurations in different regions of the support plate, with the first wires in the center region and second wires in the edge region, allowing for adjusted lengths and connections to achieve uniform heat distribution across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If parallel-connected heating wires are used to heat the substrate, then the heating coverage area is increased, but the resistance increases and heating uniformity deteriorates
Solution Approach 1:
The heating system is segmented into multiple heating wire groups (first heating wire group, second heating wire group, third heating wire group) with different connection configurations. Each group serves a specific region of the substrate, allowing independent optimization of heating characteristics for different areas while maintaining overall heating coverage.
Solution Approach 2:
Different regions of the substrate receive heating from wire groups with different connection types (series or parallel) and different wire lengths. The center region uses one configuration while edge regions use another, creating local quality variations that compensate for the natural decrease in heating effectiveness toward the edges.
2Area of stationary object
If heating wires are extended toward the edge of the support plate to increase coverage, then the area covered is increased, but the resistance increases and desired heat amount cannot be obtained
Solution Approach 1:
Heating wire groups located at different positions (center vs. edge regions) are designed with different connection configurations and wire lengths. Edge region wire groups use configurations that provide sufficient power despite longer wire lengths, while center region wire groups use configurations optimized for their position.
Solution Approach 2:
The connection configuration (series or parallel) and wire length parameters are varied across different heating wire groups based on their location. This allows optimization of the resistance and power output parameters for each specific region, ensuring adequate heat amount is achieved throughout the entire substrate area.
3Reliability
If parallel-connected heating wires with smaller intervals are used, then heating uniformity is improved, but the entire length increases making them inappropriate for small areas
Solution Approach 1:
The heating system is divided into multiple wire groups with different connection types. Series-connected groups use longer wires with larger intervals, while parallel-connected groups use shorter wires with smaller intervals. This segmentation allows each group to be optimized for its specific function without requiring the entire system to use one configuration.
Solution Approach 2:
Instead of using a single uniform wire configuration throughout, the patent inverts the conventional approach by using different connection types (series and parallel) in different regions. This inversion allows the system to achieve both heating uniformity and area efficiency by matching wire configuration to spatial requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables uniform heating of the substrate surface by optimizing heat transfer through varied resistance and length arrangements, ensuring consistent temperature across the substrate, even in small areas, thereby improving the efficiency of substrate treatment processes.
Implementation Method 1
Heating wires are disposed within the support plate to heat the substrate to a certain temperature
Data Source
AI summary
Provided is a substrate supporting unit, which includes a support plate on which a substrate is placed, and a heating member disposed within the support plate to heat the support plate. The heating member includes a plurality of first heating wires disposed in a first region of the support plate, and a plurality of second heating wires disposed in a second region of the support plate, which is different from the first region. The first heating wires are connected to each other through one of a series connection and a parallel connection, and the second heating wires are connected to each other through the other of the series connection and the parallel connection.