Substrate Support Heating Zones Using Resistance-Based Temperature Control
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Solution Overview
Problem
Current temperature control systems for substrate processing in electronic device manufacturing suffer from inaccurate and delayed real-time temperature measurements due to limitations in embedded temperature sensors, leading to defects in etching and deposition processes.
Innovation Solution
A method and apparatus that utilize direct current (DC) power to heating elements embedded in a substrate support assembly, where the temperature is determined by measuring voltage and current across the heating elements, allowing for precise control of temperature zones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If embedded temperature sensors are used to measure substrate temperature, then temperature measurement capability is provided, but measurement accuracy and real-time performance deteriorate due to delays and transmission defects
Solution Approach 1:
The heating element serves dual functions: heating the substrate and sensing its temperature. By measuring the electrical properties (voltage, current, resistance) of the heating element itself, the system obtains real-time temperature data without requiring separate sensor components, thereby eliminating measurement delays and improving accuracy.
Solution Approach 2:
The heating element is transformed into a multi-functional component that simultaneously performs heating and temperature sensing. This eliminates the need for dedicated temperature sensors, reducing system complexity and improving measurement responsiveness while maintaining temperature control capability.
2Device complexity
If fewer embedded temperature sensors are used than substrate support zones, then device complexity is reduced, but temperature measurement accuracy for each zone deteriorates
Solution Approach 1:
The substrate support assembly is divided into multiple independently controllable heating zones, each with its own heating element. By making each heating element individually addressable and measurable, the system achieves zone-specific temperature control and measurement without requiring separate sensor components for each zone, thus maintaining measurement precision while reducing overall device complexity.
Solution Approach 2:
Each heating element serves as both a heating device and a temperature sensor for its corresponding zone. This multi-functionality allows the system to achieve accurate zone-specific temperature measurements using the same components that provide heating, eliminating the need for additional sensor hardware and reducing device complexity.
3Reliability
If embedded temperature sensors are used, then temperature feedback is provided, but system reliability deteriorates due to sensor defects and transmission errors
Solution Approach 1:
The heating element monitors its own operational state by measuring its electrical properties (voltage, current, resistance). Since the heating element is an integral part of the substrate support assembly, it provides direct and reliable temperature feedback without requiring separate sensor components that could fail or transmit erroneous data, thereby improving system reliability and preventing information loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables accurate, real-time temperature control, reducing substrate defects by quickly identifying and correcting temperature deviations, and potentially eliminating the need for separate temperature sensors, thereby simplifying and cost-reducing the system.
Implementation Method 1
supplying a first direct current (DC) power to a heating element embedded in a zone of a substrate support assembly
Implementation Method 2
measuring a voltage across the heating element and a current through the heating element. The method further includes determining, based on the voltage across the heating element and the current through the heating element, a temperature of the zone
Data Source
AI summary
A direct current (DC) power is supplied to a heating element embedded into a substrate support assembly (SSA). A voltage across the heating element and a current through the heating element is measured as the DC power is supplied to the heating element. A resistance of the heating element is determined based on the measured voltage and current. A temperature measurement for the heating element and/or a zone including the heating element is obtained based on signal(s) of a temperature sensor. A temperature model is updated based on the determined resistance and the obtained temperature measurement. The heating element embedded in the SSA and/or an additional heating element embedded in the SSA or in another SSA is controlled based on the updated temperature model during a substrate process.