Substrate Height Measurement Avoiding Circuit Interference
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Solution Overview
Problem
The presence of circuit forming members, through holes, and identification codes on substrates can interfere with measurement devices, reducing the accuracy of substrate height measurements.
Innovation Solution
A substrate height measuring device comprising an imaging section, a setting section, and a measurement section, which allows for the adjustment of the measurement position based on a displayed substrate image, enabling accurate height measurement by avoiding interfering features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If measurement is performed at predetermined positions on substrate, then measurement process is simplified and productivity is improved, but measurement accuracy deteriorates due to interference from circuit forming members and identification codes
Solution Approach 1:
The measurement position is made dynamically adjustable based on the imaged substrate pattern. The system allows shifting the measurement position from the predetermined position to a position free from pattern interference, while maintaining the automated measurement workflow. This dynamic adjustment resolves the contradiction by enabling both efficient predetermined positioning and accurate measurement avoidance of interfering features.
Solution Approach 2:
An image processing section acts as an intermediary between the predetermined measurement position and the actual measurement. It images the substrate pattern, identifies interfering features, and determines an adjusted measurement position that avoids these features. This intermediary process enables the system to maintain productivity while improving measurement accuracy.
2Ease of operation
If measurement position is fixed at predetermined location, then device operation is simplified, but measurement accuracy is reduced due to interference from substrate features
Solution Approach 1:
The system performs preliminary imaging of the substrate pattern before measurement to identify interfering features. This preliminary action allows the measurement position to be adjusted in advance based on the actual substrate features, maintaining operational simplicity while improving measurement accuracy by avoiding pattern interference.
Solution Approach 2:
The image processing section serves as an intermediary that automatically analyzes the substrate pattern and determines the optimal measurement position. This intermediary function maintains ease of operation by automating the position selection process while improving measurement accuracy by selecting positions free from pattern interference.
Data Source
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AI summary
A substrate height measuring device includes an imaging section, a setting section, and a measurement section. The imaging section allows an imaging device to image a region of at least a part of a clamped substrate, the region including a measurement planned position at which a height of the substrate is to be measured. The setting section allows a display device to display a substrate image imaged by the imaging section and adjusts a measurement position at which the height of the substrate is actually measured based on the measurement planned position of the substrate image displayed on the display device to set the measurement position. The measurement section allows a measurement device to measure the height of the substrate at the measurement position set by the setting section.