Substrate Holder Vacuum Control for Precise Bond Wave Propagation
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Solution Overview
Problem
Existing substrate holder devices for bonding substrates face challenges such as increased complexity, space requirements, susceptibility to errors, and thermal issues due to multiple individually controlled vacuum tracks, which affect the alignment and bonding process.
Innovation Solution
A substrate holder device utilizing a single, pneumatically operated control valve to manage multiple vacuum openings, reducing the need for individual electronically controlled valves, thereby minimizing heat input and error susceptibility, and allowing for controlled manipulation of bond waves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple individually controlled vacuum tracks are used in substrate holder devices, then the control precision of bond wave propagation is improved, but the device complexity and susceptibility to errors increase
Solution Approach 1:
The patent combines multiple vacuum track controls into a single pneumatic control valve that manages all vacuum openings simultaneously. This merging approach maintains the ability to control bond wave propagation across multiple zones while reducing the number of individual electronic valves and associated control systems, thereby decreasing device complexity and error susceptibility.
Solution Approach 2:
The single pneumatic control valve performs multiple functions by controlling all vacuum openings through one unified mechanism. This multi-functional component replaces what would otherwise require multiple specialized electronic valves, simplifying the overall system while maintaining comprehensive control over the bonding process.
2Measurement precision
If multiple electronically controlled valves are used to manage vacuum tracks, then the control precision is improved, but the heat input and thermal stress increase
Solution Approach 1:
The patent replaces electronic control valves with a pneumatic control system. This substitution eliminates the electronic components and associated heat generation while maintaining the ability to precisely control vacuum tracks through pneumatic actuation, thereby reducing thermal stress on the substrate and bonding system.
Solution Approach 2:
The invention employs pneumatic pressure control to manage all vacuum openings through a single valve. This pneumatic system provides precise control without the thermal byproducts of electronic valve operation, reducing heat input to the bonding process while maintaining control precision.
3Adaptability or versatility
If multiple individually controlled vacuum tracks are used, then the manipulation of bond wave propagation is improved, but the space requirements and device size increase
Solution Approach 1:
The patent merges multiple vacuum track control functions into a single integrated pneumatic valve assembly. This consolidation maintains the versatility to manipulate bond wave propagation across different zones while reducing the total space required for control components by eliminating redundant electronic valves and associated mounting space.
4Extent of automation
If multiple electronic control valves are used, then the control capability is improved, but the susceptibility to errors and reliability decrease
Solution Approach 1:
The patent combines multiple control functions into a single pneumatic valve system, reducing the total number of control components. This merger maintains comprehensive control capability while minimizing the points of potential failure, as fewer components mean fewer opportunities for errors to occur in the bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the quality and efficiency of the bonding process by reducing thermal stress and error probability, enabling precise control of bond wave propagation and alignment, thus improving the accuracy and reliability of substrate bonding.
Implementation Method 1
a control valve (6), in particular a pneumatic control valve (6), for influencing the vacuum with at least one port (13)
Implementation Method 2
substrate holder device (1) contains a substrate holder (2)... influencing the vacuum with at least one port (13)
Implementation Method 3
bonding process takes place by van-der-Waals forces alone
Data Source
AI summary
The invention relates to a substrate holder device at least including at least one control valve and at least one substrate holder with a substrate holder surface and a substrate holder rear side. Furthermore, the invention relates to bonding device and a method for bonding.