Substrate Holder Thermal Management for Bonding Alignment

The patent applies parameter changes by controlling the temperature distribution across the substrate during bonding. Specifically, it uses a temperature gradient where the center region is heated to a higher temperature than the peripheral region, allowing the substrate to expand uniformly and maintain alignment accuracy while still achieving strong bonding strength through the heated central area where the functional units are located.

The patent implements local quality by applying different temperature conditions to different regions of the substrate. The central region, where the functional units are located, is heated to a higher temperature to ensure strong bonding, while the peripheral region is kept at a lower temperature to minimize thermal expansion and maintain alignment accuracy. This localized temperature control resolves the contradiction between maximizing bonding strength and preventing run-out faults.

The patent applies preliminary action by pre-heating the substrate in a controlled manner before the actual bonding process. The substrate is first heated uniformly at a moderate rate to allow thermal equilibrium to be established, and then the temperature gradient is applied. This preliminary heating step prevents sudden thermal shocks that would cause distortion, while still enabling the subsequent rapid bonding process to proceed efficiently.